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NTD4813NH-1G

Onsemi

NTD4813NH-1G by Onsemi

NTD4813NH-1G by Onsemi is a Power FET with 30V DS Breakdown Voltage, 90A IDM, and 0.0259 ohm RDS(ON). It is an N-CHANNEL transistor in PLASTIC/EPOXY package for high-current applications like motor control and power supplies.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,968 parts In-Stock

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4 Star Electronics, Inc.

USA . 631 parts In-Stock

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Digiode

USA . 356 parts In-Stock

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AZTECH Wire

Italy . 573 parts In-Stock

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$16.690

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Kulean Microsystems

USA . 7,282 parts In-Stock

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TANS Electronics

Latvia . 5,167 parts In-Stock

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SupplyDigital Components

Austria . 4,635 parts In-Stock

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Corphita

USA . 2,307 parts In-Stock

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Problanco Electronics

Mexico . 1,268 parts In-Stock

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UHIMA Technologies

Türkiye . 965 parts In-Stock

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Corohmni

South Africa . 367 parts In-Stock

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Overview

Enhance your power management with the NTD4813NH-1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers top-notch quality and reliability. Ideal for a wide range of applications, this FET delivers superior performance and efficiency. With a high pulsated drain current and low on-resistance, this product provides unparalleled value, making it a smart choice for your projects. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the FET long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower on-resistance compared to P-channel FETs, making them efficient for power applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage applications without compromising performance or safety.

Maximum Pulsed Drain Current (IDM): 90 A

The high maximum pulsed drain current allows the FET to handle sudden surges in power without being damaged, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 44.4 mJ

The high avalanche energy rating ensures that the FET can withstand sudden voltage spikes or transients, adding to its reliability and durability.

Maximum Drain Current (ID): 40 A

With a maximum drain current of 40A, this FET can handle high current loads without overheating or failing, making it suitable for power applications.

Technical Specifications

Power Field Effect Transistors (FET) NTD4813NH-1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

44.4 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.0259 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

90 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NTD4813NH-1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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