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NTD32N06T4G

Onsemi

NTD32N06T4G by Onsemi

NTD32N06T4G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 32A Drain Current, and 0.026 ohm RDS(ON). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode, it has a max power dissipation of 93.75W at 175 °C.

Median Price

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Lifecycle Status

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3

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1k+

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Chip Stock

USA . 24,000 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 798 parts In-Stock

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Metaverse IC Inc.

Canada . 38,652 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,611 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 8,367 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,892 parts In-Stock

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SupplyDigital Components

Austria . 4,079 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 1,117 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 118 parts In-Stock

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Overview

Elevate your power management capabilities with the Onsemi NTD32N06T4G Power Field Effect Transistor. Crafted by a trusted manufacturer, this N-CHANNEL FET boasts high-quality construction and a built-in diode for seamless switching applications. Its impressive 60V minimum DS breakdown voltage and 32A maximum drain current deliver reliable performance, while the 93.75W maximum power dissipation ensures long-term durability. Upgrade your electronic designs with this versatile transistor, offering enhanced efficiency and power handling for a wide range of applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capability compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance.

Surface Mount: YES

Enables easy integration onto PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

Can handle high voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 90 A

Capable of handling high current spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 93.75 W

Can dissipate heat effectively, allowing for continuous operation at high power levels.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high performance and efficiency in switching applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation in performance.

Technical Specifications

Power Field Effect Transistors (FET) NTD32N06T4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

313 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

32 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

90 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTD32N06T4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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