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NTC020N120SC1

Onsemi

NTC020N120SC1 by Onsemi

NTC020N120SC1 by Onsemi is a power FET with N-channel configuration and built-in diode, ideal for switching applications. It features a 1200V DS breakdown voltage, 412A max pulsed drain current, and 264mJ avalanche energy rating. Operating in enhancement mode, it has a max power dissipation of 535W and can withstand temperatures from -55 to 175 °C.

Median Price

$39.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 456 parts In-Stock

1+ parts

-

100+ parts

$35.200

1k+ parts

$31.490

10k+ parts

$29.640

456

-

$35.200

$31.490

$29.640

Verical

USA . 456 parts In-Stock

1+ parts

-

100+ parts

$44.000

1k+ parts

$39.362

10k+ parts

$37.050

456

-

$44.000

$39.362

$37.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,734 parts In-Stock

1+ parts

$37.240

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1,734

$37.240

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Vyrian

USA . 3,540 parts In-Stock

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3,540

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Flip Electronics

USA . 985 parts In-Stock

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985

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$8.640

100+ parts

-

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540

$8.640

-

-

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Corphita

USA . 561 parts In-Stock

1+ parts

$35.280

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561

$35.280

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Corohmni

South Africa . 135 parts In-Stock

1+ parts

$39.200

100+ parts

-

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135

$39.200

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Problanco Electronics

Mexico . 5,728 parts In-Stock

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5,728

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TANS Electronics

Latvia . 3,109 parts In-Stock

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3,109

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SupplyDigital Components

Austria . 1,916 parts In-Stock

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1,916

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Kulean Microsystems

USA . 1,800 parts In-Stock

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1,800

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UHIMA Technologies

Türkiye . 659 parts In-Stock

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659

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Overview

Discover the NTC020N120SC1 by Onsemi, a top-of-the-line Power Field Effect Transistor that offers unmatched quality and reliability. With its N-CHANNEL configuration and SINGLE WITH BUILT-IN DIODE design, this transistor is perfect for SWITCHING applications. Boasting an impressive 1200 V minimum DS Breakdown Voltage and 535 W Maximum Power Dissipation, this product guarantees optimal performance. Trust Onsemi's expertise in semiconductor technology to deliver superior products like the NTC020N120SC1. Upgrade your electronics with this high-quality transistor today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product a good choice for applications requiring high performance.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltages, making it suitable for high power applications and ensuring reliability.

Maximum Pulsed Drain Current (IDM): 412 A

The high pulsed drain current capability of this FET allows for handling large current spikes, making it ideal for demanding switching applications.

Maximum Power Dissipation (Abs): 535 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliability under heavy loads.

Technical Specifications

Power Field Effect Transistors (FET) NTC020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

103 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-XUUC-N4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

412 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTC020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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