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NTC015N065SC1

Onsemi

NTC015N065SC1 by Onsemi

NTC015N065SC1 by Onsemi is an N-CHANNEL Power FET with 650V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max IDM of 1006A and Max ID of 159A. Operating in ENHANCEMENT MODE, this transistor has a Max Power Dissipation of 774W and can withstand temperatures from -55 to 175 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,413 parts In-Stock

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Vyrian

USA . 939 parts In-Stock

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Problanco Electronics

Mexico . 7,872 parts In-Stock

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Kulean Microsystems

USA . 6,654 parts In-Stock

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SupplyDigital Components

Austria . 6,126 parts In-Stock

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TANS Electronics

Latvia . 3,572 parts In-Stock

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Corphita

USA . 2,246 parts In-Stock

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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Corohmni

South Africa . 200 parts In-Stock

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Overview

Experience the superior performance and reliability of the NTC015N065SC1 by Onsemi, a leading manufacturer in the industry. As a powerful N-CHANNEL Power Field Effect Transistor with a built-in diode, this product is ideal for switching applications, offering unparalleled efficiency and durability. With a high DS Breakdown Voltage of 650V and a maximum Pulsed Drain Current of 1006A, customers can trust in the quality and value that this transistor provides. From its advanced silicon carbide technology to its wide operating temperature range, the NTC015N065SC1 delivers exceptional results for all your power control needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have lower ON resistance and higher current-carrying capacity, making them efficient for many switch applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode helps in protecting the circuit from reverse polarity and inductive kickback, enhancing the reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient on/off operation and minimal power loss.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage allows the FET to handle high voltage loads, making it suitable for high power applications.

Maximum Pulsed Drain Current (IDM): 1006 A

Capable of handling high current pulses, ideal for applications requiring high power transients.

Maximum Power Dissipation (Abs): 774 W

High power dissipation rating ensures the FET can operate effectively under heavy load conditions without overheating.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures, suitable for demanding industrial environments.

Transistor Element Material: SILICON CARBIDE

Silicon carbide offers high thermal conductivity and can handle high voltages, making it a durable and reliable material for power FETs.

Technical Specifications

Power Field Effect Transistors (FET) NTC015N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

159 A

Maximum Drain Current (ID):

159 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUUC-N4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1006 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTC015N065SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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