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NTC040N120SC1

Onsemi

NTC040N120SC1 by Onsemi

NTC040N120SC1 by Onsemi is a Power FET with 1200V DS Breakdown Voltage, 240A IDM, and 0.056 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with SILICON CARBIDE material. With a max power dissipation of 348W and operating temperature range from -55 to 175 °C, it offers reliable performance.

Median Price

$13.582

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 554 parts In-Stock

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$554.830

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Verical

USA . 3,032 parts In-Stock

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$15.088

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$13.500

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Rochester

USA . 3,032 parts In-Stock

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$12.070

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$10.800

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$10.170

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$12.070

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$10.170

DigiKey

USA . 819 parts In-Stock

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$12.075

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$12.075

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Digiode

USA . 1,545 parts In-Stock

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$527.088

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Flip Electronics

USA . 25,487 parts In-Stock

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Vyrian

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Corohmni

South Africa . 436 parts In-Stock

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$14.148

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Microchip USA

USA . 5,005 parts In-Stock

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$46.488

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Corphita

USA . 1,993 parts In-Stock

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$499.347

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Kulean Microsystems

USA . 7,825 parts In-Stock

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SupplyDigital Components

Austria . 5,981 parts In-Stock

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Problanco Electronics

Mexico . 3,872 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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TANS Electronics

Latvia . 708 parts In-Stock

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Overview

Unlock the power of innovation with the Onsemi NTC040N120SC1 Power Field Effect Transistor. Manufactured by a trusted industry leader, this N-channel transistor offers unparalleled reliability and performance. Ideal for switching applications, this single configuration with a built-in diode ensures seamless operation. With a maximum pulsed drain current of 240A and a minimum DS breakdown voltage of 1200V, this transistor is designed to deliver exceptional power dissipation and efficiency. Experience cutting-edge technology with the NTC040N120SC1 and revolutionize your electronic projects today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in high power applications due to their low ON resistance and high current carrying capacity.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, making this FET suitable for applications where back EMF is a concern.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON resistance, making it efficient for power management.

Surface Mount: YES

Surface mount FETs are easier to assemble on circuit boards, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltages without breakdown, ensuring reliable performance in high power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, making it suitable for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NTC040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

613 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-XUUC-N4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTC040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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