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NTC050N065SC1

Onsemi

NTC050N065SC1 by Onsemi

NTC050N065SC1 by Onsemi is a Power FET with 650V DS Breakdown Voltage, 373A IDM, and 325W Pd. Ideal for high-power applications due to its Silicon Carbide material, it operates in Enhancement Mode with a max temperature of 175 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,142 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 3,711 parts In-Stock

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Kulean Microsystems

USA . 3,546 parts In-Stock

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TANS Electronics

Latvia . 1,398 parts In-Stock

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Problanco Electronics

Mexico . 1,269 parts In-Stock

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Corphita

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Corohmni

South Africa . 460 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Overview

Discover the power and reliability of the NTC050N065SC1 by Onsemi, a top-quality Power Field Effect Transistor with built-in diode. Ideal for a range of applications, this N-CHANNEL FET offers unparalleled performance and efficiency. With a high DS Breakdown Voltage of 650V and a maximum Drain Current of 61.5A, this transistor is designed to handle demanding tasks with ease. Trust in Onsemi's reputation for excellence and invest in a product that delivers value, benefits, and advantages to customers seeking top-notch solutions for their electronic needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and low on-state resistance, making them suitable for high-power applications.

Minimum DS Breakdown Voltage: 650V

With a high breakdown voltage, this FET can withstand high voltage environments, ensuring reliable operation.

Maximum Pulsed Drain Current (IDM): 373A

The high pulsed drain current capability allows this FET to handle sudden surges in current, making it ideal for applications requiring high-power pulses.

Maximum Power Dissipation (Abs): 325W

The high power dissipation capability of this FET allows it to handle high levels of power without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature range of 175 °C allows this FET to operate in harsh environmental conditions without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTC050N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

61.5 A

Maximum Drain Current (ID):

61.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

14.43 pF

JESD-30 Code:

R-XXUC-N3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

373 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UNSPECIFIED

Transistor Element Material:

SILICON CARBIDE

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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