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NTA4001NT1G

Onsemi

NTA4001NT1G by Onsemi

NTA4001NT1G by Onsemi is a small signal FET with N-channel configuration, built-in diode and resistor for switching applications. It features a min DS breakdown voltage of 20V, max drain current of 0.238A, and max power dissipation of 0.3W. This MOSFET operates in enhancement mode with a max temperature of 150°C, making it suitable for various electronic devices requiring efficient power management.

Median Price

$0.122

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11,223 parts In-Stock

1+ parts

$0.227

100+ parts

$0.091

1k+ parts

$0.052

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$0.029

11,223

$0.227

$0.091

$0.052

$0.029

DigiKey

USA . 63,940 parts In-Stock

1+ parts

$0.240

100+ parts

$0.091

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$0.059

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$0.041

63,940

$0.240

$0.091

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$0.041

Mouser Electronics

USA . 46,858 parts In-Stock

1+ parts

$0.240

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$0.037

46,858

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Newark

USA . 3,200 parts In-Stock

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$0.251

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Future Electronics

Canada . 1,107,000 parts In-Stock

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Chip1Stop

Japan . 18,014 parts In-Stock

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Avnet

USA . 18,000 parts In-Stock

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Verical

USA . 11,223 parts In-Stock

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Master Electronics

USA . 6,000 parts In-Stock

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Rochester

USA . 3,099 parts In-Stock

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Farnell

UK . 2,860 parts In-Stock

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Element14

Singapore . 2,700 parts In-Stock

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$0.133

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2,700

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Distributors (In-Stock)

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Digiode

USA . 2,113 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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Maritex

Poland . 6,171 parts In-Stock

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$0.072

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$0.043

Component Electronics Inc.

Canada . 2,265 parts In-Stock

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$0.650

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$0.490

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$0.430

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IBS Electronics

USA . 2,799,001 parts In-Stock

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NAC Semi

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Chip Stock

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Italy . 72,000 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Speed Components Ltd

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Bristol Electronics

USA . 3,896 parts In-Stock

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Semi Source

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Ampacity Inc.

Singapore . 16,215 parts In-Stock

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$0.038

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Corphita

USA . 627 parts In-Stock

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Corohmni

South Africa . 180 parts In-Stock

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Component Stockers USA

USA . 77,096 parts In-Stock

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Argo Parts USA

USA . 4,538 parts In-Stock

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$0.088

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$0.410

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.871

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$0.793

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$0.714

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Perfect Parts

USA . 438,565 parts In-Stock

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USA . 105,419 parts In-Stock

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Kepictronics

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Eastek

USA . 78,000 parts In-Stock

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S.R.D Solutions

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Continental Prestige Electronics

USA . 21,565 parts In-Stock

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Lixinc

USA . 17,063 parts In-Stock

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SupplyDigital Components

Austria . 6,450 parts In-Stock

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Problanco Electronics

Mexico . 6,344 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

Spain . 5,995 parts In-Stock

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TANS Electronics

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Kulean Microsystems

USA . 2,338 parts In-Stock

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

Türkiye . 370 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$0.097

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$0.097

Overview

Discover the NTA4001NT1G by Onsemi, a high-quality Small Signal Field Effect Transistor designed for switching applications. With a single configuration and built-in diode and resistor, this N-CHANNEL transistor offers unparalleled performance and reliability. Perfectly suited for surface mount installations, this product boasts a maximum drain current of 0.238 A and a minimum DS breakdown voltage of 20 V. Trust Onsemi's reputation for excellence and elevate your projects with the NTA4001NT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and resistant to impact, making it easier to handle and less likely to break during installation or use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics and higher efficiency compared to P-channel transistors, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify the circuit design and reduce the need for external components, making the overall system more compact and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low on-resistance, making it ideal for use in high-frequency circuits.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20 V ensures reliable operation and protection against voltage spikes or transients in the circuit.

Maximum Drain Current (Abs) (ID): 0.238 A

With a high maximum drain current rating, this transistor can handle higher loads and provide greater power output in the circuit.

Maximum Power Dissipation (Abs): 0.3 W

The maximum power dissipation rating of 0.3 W indicates that this transistor can handle higher power levels without overheating, ensuring reliable performance in demanding applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows for operation in a wide range of environments and ensures long-term reliability under varying temperature conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTA4001NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.238 A

Maximum Drain Current (ID):

.238 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

6 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTA4001NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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