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NLU1GT125BMX1TCG

Onsemi

NLU1GT125BMX1TCG by Onsemi

NLU1GT125BMX1TCG by Onsemi is a CMOS bus driver with 22ns propagation delay, 16ns tpd, and 3-state output. It operates at -55 to 125 °C and has a supply voltage range of 1.65-5.5V. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

66,000

-

$0.092

$0.077

$0.068

Avnet

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.080

10k+ parts

$0.070

66,000

-

-

$0.080

$0.070

Verical

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

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$0.086

60,000

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-

$0.086

Distributors (In-Stock)

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Digiode

USA . 2,163 parts In-Stock

1+ parts

$0.072

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2,163

$0.072

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Vyrian

USA . 4,315 parts In-Stock

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4,315

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Netsource Technology, Inc.

USA . 3,048 parts In-Stock

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3,048

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Distributors (Availability)

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Ampacity Inc.

Singapore . 63,530 parts In-Stock

1+ parts

$0.065

100+ parts

-

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63,530

$0.065

-

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Corphita

USA . 2,347 parts In-Stock

1+ parts

$0.068

100+ parts

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2,347

$0.068

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Vigor

Singapore . 850 parts In-Stock

1+ parts

$0.070

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850

$0.070

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$0.076

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251

$0.076

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AZTECH Wire

Italy . 1,098 parts In-Stock

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$11.200

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1,098

$11.200

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Continental Prestige Electronics

USA . 66,000 parts In-Stock

1+ parts

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100+ parts

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$0.066

10k+ parts

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66,000

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$0.066

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Kepictronics

USA . 22,292 parts In-Stock

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22,292

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TANS Electronics

Latvia . 7,591 parts In-Stock

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Kulean Microsystems

USA . 4,078 parts In-Stock

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4,078

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Problanco Electronics

Mexico . 681 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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645

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Microchip USA

USA . 332 parts In-Stock

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332

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SupplyDigital Components

Austria . 36 parts In-Stock

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Overview

Enhance your electronic designs with the NLU1GT125BMX1TCG by Onsemi! Known for their top-quality products, Onsemi delivers reliable bus drivers & transceivers like this one, perfect for a wide range of applications. With a nominal supply voltage of 3V and a propagation delay of just 22ns, this small outline package offers fast and efficient performance. Trust in Onsemi's expertise and elevate your projects with the unbeatable value and benefits that the NLU1GT125BMX1TCG provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it ideal for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this product energy-efficient and compatible with a wide range of systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of the package make it space-saving and convenient for compact designs and applications.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high flexibility in controlling the bus lines, enabling efficient data transmission and communication.

Temperature Grade: MILITARY

Designed for military-grade applications, this product offers exceptional reliability and performance under harsh environmental conditions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers NLU1GT125BMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1GT125BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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