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NLU1GT125AMX1TCG

Onsemi

NLU1GT125AMX1TCG by Onsemi

NLU1GT125AMX1TCG by Onsemi is a 3-STATE bus driver with 22ns propagation delay, suitable for military applications. It operates at a supply voltage range of 1.8V to 5V and has a max operating temperature of 125 °C. This CMOS technology device comes in a small outline package with dual terminals and nickel palladium gold finish, making it ideal for high-performance communication systems.

Median Price

$0.354

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,330 parts In-Stock

1+ parts

$0.616

100+ parts

$0.196

1k+ parts

$0.151

10k+ parts

-

4,330

$0.616

$0.196

$0.151

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Rochester

USA . 1,090 parts In-Stock

1+ parts

-

100+ parts

$0.092

1k+ parts

$0.077

10k+ parts

$0.068

1,090

-

$0.092

$0.077

$0.068

Distributors (In-Stock)

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Digiode

USA . 1,633 parts In-Stock

1+ parts

$0.072

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1,633

$0.072

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J2 Sourcing AB

Sweden . 78,000 parts In-Stock

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78,000

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Vyrian

USA . 5,243 parts In-Stock

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5,243

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Distributors (Availability)

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Corphita

USA . 648 parts In-Stock

1+ parts

$0.068

100+ parts

-

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648

$0.068

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Vigor

Singapore . 189 parts In-Stock

1+ parts

$0.070

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189

$0.070

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Corohmni

South Africa . 93 parts In-Stock

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$0.076

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93

$0.076

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Component Stockers USA

USA . 1,489 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

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1,489

$0.080

$0.070

$0.070

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AZTECH Wire

Italy . 784 parts In-Stock

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$13.480

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784

$13.480

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Perfect Parts

USA . 26,472 parts In-Stock

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TANS Electronics

Latvia . 4,349 parts In-Stock

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SupplyDigital Components

Austria . 1,469 parts In-Stock

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Problanco Electronics

Mexico . 1,316 parts In-Stock

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Continental Prestige Electronics

USA . 1,090 parts In-Stock

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$0.066

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Kulean Microsystems

USA . 733 parts In-Stock

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733

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Microchip USA

USA . 411 parts In-Stock

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UHIMA Technologies

Türkiye . 339 parts In-Stock

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339

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Overview

Enhance your electronic designs with the NLU1GT125AMX1TCG by Onsemi, a top-tier manufacturer known for high-quality components. As a part of the Bus Driver & Transceivers category, this product offers fast propagation delay and 3-state output characteristics, making it perfect for applications requiring quick signal transmission. With a small outline package and low power consumption, this device provides excellent value and performance to customers looking to optimize their circuit designs. Upgrade your projects with the reliability and efficiency of Onsemi's NLU1GT125AMX1TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver and transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 22 ns

The low propagation delay helps in reducing signal latency, making this product suitable for high-speed data transmission applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and improving overall system design.

Nominal Supply Voltage / Vsup (V): 3

The low nominal supply voltage of 3V helps in minimizing power consumption, making this product energy-efficient.

Output Characteristics: 3-STATE

The 3-state output allows for the bus driver and transceivers to be tri-stated, giving flexibility in controlling the data flow and bus lines.

Temperature Grade: MILITARY

The military-grade temperature range ensures reliable operation in harsh environments, making this product suitable for military and aerospace applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers NLU1GT125AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

1G

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1GT125AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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