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NLU1GT125CMX1TCG

Onsemi

NLU1GT125CMX1TCG by Onsemi

NLU1GT125CMX1TCG by Onsemi is a CMOS bus driver with 22ns propagation delay, 3-state output, and 4A max I (ol). It operates at -55 to 125 °C and has a package style of small outline. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.134

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 517,525 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

517,525

-

$0.119

$0.099

$0.088

Verical

USA . 507,000 parts In-Stock

1+ parts

-

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$0.149

507,000

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-

-

$0.149

Distributors (In-Stock)

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Digiode

USA . 2,313 parts In-Stock

1+ parts

$0.093

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2,313

$0.093

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Vyrian

USA . 3,921 parts In-Stock

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3,921

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J2 Sourcing AB

Sweden . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 936 parts In-Stock

1+ parts

$0.088

100+ parts

-

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936

$0.088

-

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Vigor

Singapore . 500 parts In-Stock

1+ parts

$0.090

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500

$0.090

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Corohmni

South Africa . 356 parts In-Stock

1+ parts

$0.098

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356

$0.098

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$14.330

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639

$14.330

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.656

100+ parts

$20.617

1k+ parts

$18.578

10k+ parts

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1,000

$22.656

$20.617

$18.578

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Continental Prestige Electronics

USA . 517,525 parts In-Stock

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$0.085

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517,525

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$0.085

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QUARKTWIN TECHNOLOGY LTD

USA . 11,534 parts In-Stock

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Microchip USA

USA . 6,472 parts In-Stock

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6,472

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Kulean Microsystems

USA . 6,365 parts In-Stock

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Problanco Electronics

Mexico . 4,661 parts In-Stock

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4,661

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SupplyDigital Components

Austria . 1,140 parts In-Stock

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1,140

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TANS Electronics

Latvia . 635 parts In-Stock

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635

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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142

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Overview

Elevate your electronic designs with the NLU1GT125CMX1TCG by Onsemi, a top-tier bus driver & transceiver that embodies quality and reliability. Crafted by industry-leader Onsemi, this product boasts a durable plastic/epoxy package and a swift 22ns propagation delay at nominal supply. Ideal for a wide range of applications, this small outline, very thin profile device offers customers exceptional value and benefits. Experience seamless communication and enhanced performance with the NLU1GT125CMX1TCG - your go-to solution for cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the bus driver & transceiver, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying production processes.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes this bus driver & transceiver compatible with a wide range of systems, offering versatility in design.

Package Shape: SQUARE

Square package shape provides a compact form factor, enabling convenient mounting and placement within limited space constraints.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance mode, providing flexibility in controlling the bus lines and minimizing signal interference.

Temperature Grade: MILITARY

Military-grade temperature range (-55 °C to 125°C) ensures reliable operation in harsh environmental conditions, making this product suitable for mission-critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus driver & transceiver.

Control Type: ENABLE LOW

Enable low control type allows for easy activation of the device by bringing the control signal to a low voltage, simplifying the operation and integration into the system.

Technical Specifications

Bus Driver & Transceivers NLU1GT125CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

1G

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLU1GT125CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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