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NLU1GT125CMUTCG

Onsemi

NLU1GT125CMUTCG by Onsemi

NLU1GT125CMUTCG by Onsemi is a 3-STATE bus driver with 6 terminals, operating at -55 to 125 °C. It has a propagation delay of 16 ns and can handle a load capacitance of 50 pF. Ideal for military applications requiring true output polarity and low enable control.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,661 parts In-Stock

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Digiode

USA . 2,115 parts In-Stock

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AZTECH Wire

Italy . 857 parts In-Stock

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Component Stockers USA

USA . 274 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,288 parts In-Stock

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Metaverse IC Inc.

Canada . 26,000 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 6,939 parts In-Stock

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TANS Electronics

Latvia . 2,704 parts In-Stock

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Problanco Electronics

Mexico . 2,128 parts In-Stock

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Microchip USA

USA . 1,144 parts In-Stock

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Corphita

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Kulean Microsystems

USA . 474 parts In-Stock

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UHIMA Technologies

Türkiye . 217 parts In-Stock

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Corohmni

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Overview

Elevate your electronic designs with the NLU1GT125CMUTCG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality bus drivers and transceivers that provide reliable performance in various applications. This square-shaped device offers a nominal supply voltage of 3V, true output polarity, and a maximum IOL of 8 Amp, making it ideal for military-grade projects requiring precision and efficiency. With its advanced technology and durable construction, this product ensures seamless operation and optimal functionality, providing customers with unparalleled value and peace of mind. Experience the difference with Onsemi's NLU1GT125CMUTCG - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in transportation applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and resources during production.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V is commonly used in many electronic devices, making this bus driver compatible with a wide range of systems.

Propagation Delay (tpd): 16 ns

The low propagation delay of 16ns ensures fast and efficient signal transmission, reducing latency in communication systems.

Output Characteristics: 3-STATE

The 3-state output allows the bus driver to control the data bus signals effectively, providing flexibility in managing bus traffic.

Temperature Grade: MILITARY

The military-grade temperature range of -55 °C to 125°C ensures reliability and performance in harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers NLU1GT125CMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

1G

JESD-30 Code:

S-PDSO-N6

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Inputs:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLU1GT125CMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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