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NLAS1053USG

Onsemi

NLAS1053USG by Onsemi

NLAS1053USG by Onsemi is a CMOS single-ended multiplexer with 2 channels. It operates at temperatures from -55 to 125 °C and has a max supply voltage of 5.5 V. With a nominal off-state isolation of 93 dB, it is ideal for military-grade applications requiring precise signal switching in compact spaces.

Median Price

$0.461

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,565,293 parts In-Stock

1+ parts

-

100+ parts

$0.634

1k+ parts

$0.427

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$0.410

1,565,293

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$0.634

$0.427

$0.410

Rochester

USA . 1,559,655 parts In-Stock

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$0.445

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$0.369

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$0.329

1,559,655

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$0.445

$0.369

$0.329

DigiKey

USA . 1,559,655 parts In-Stock

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$0.460

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1,559,655

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$0.460

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Verical

USA . 906,000 parts In-Stock

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$0.461

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$0.411

906,000

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$0.461

$0.411

Element14

Singapore . 18 parts In-Stock

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$0.689

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$0.458

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$0.409

18

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$0.689

$0.458

$0.409

Distributors (In-Stock)

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Flip Electronics

USA . 3,000 parts In-Stock

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$0.220

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$0.220

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Digiode

USA . 932 parts In-Stock

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$0.347

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932

$0.347

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Nova Conductors

Japan . 10 parts In-Stock

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$0.398

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10

$0.398

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Vyrian

USA . 1,119,819 parts In-Stock

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Chip Stock

USA . 10,500 parts In-Stock

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Prism Electronics

USA . 2,292 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,089 parts In-Stock

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Bristol Electronics

USA . 2,089 parts In-Stock

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Semi Source

USA . 78 parts In-Stock

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Speed Components Ltd

Israel . 15 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,119,161 parts In-Stock

1+ parts

$0.310

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1,119,161

$0.310

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Semicontronic

India . 1,119,077 parts In-Stock

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$0.310

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$0.302

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$0.301

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1,119,077

$0.310

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Corphita

USA . 2,172 parts In-Stock

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$0.328

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$0.328

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Corohmni

South Africa . 60 parts In-Stock

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$0.365

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60

$0.365

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Argo Parts USA

USA . 1,247 parts In-Stock

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$0.398

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$0.386

1,247

$0.398

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$0.386

Continental Prestige Electronics

USA . 18 parts In-Stock

1+ parts

$0.823

100+ parts

$0.489

1k+ parts

$0.322

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$0.309

18

$0.823

$0.489

$0.322

$0.309

Vigor

Singapore . 378 parts In-Stock

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$0.870

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Microchip USA

USA . 5,451 parts In-Stock

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$2.412

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Aztec Data Supply Inc.

USA . 4,377 parts In-Stock

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$8.106

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Perfect Parts

USA . 30,513 parts In-Stock

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Lixinc

USA . 15,952 parts In-Stock

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Problanco Electronics

Mexico . 7,946 parts In-Stock

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TANS Electronics

Latvia . 6,375 parts In-Stock

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SupplyDigital Components

Austria . 5,742 parts In-Stock

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Kulean Microsystems

USA . 5,366 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 2,411 parts In-Stock

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Futuretech Components

Singapore . 549 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 383 parts In-Stock

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Overview

Experience seamless signal switching with the NLAS1053USG by Onsemi, a top-tier manufacturer renowned for its superior quality. As part of the multiplexers & switches category, this product offers unmatched reliability and precision in various applications. From telecommunications to industrial automation, this versatile device ensures optimal performance and efficiency. Elevate your projects with the value, benefits, and advantages that only Onsemi can deliver. Trust in the NLAS1053USG for seamless signal management and uncompromising quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer, making it reliable for long-term use.

Nominal Supply Voltage (Vsup) 4.5 V

Ideal voltage range for stable operation, ensuring optimal performance of the multiplexer.

No. of Channels 2

Provides flexibility in routing signals with two channels available, allowing for versatile usage scenarios.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer energy-efficient and reliable.

Maximum On-state Resistance (Ron) 34 ohm

Low resistance ensures minimal signal loss when passing through the multiplexer, maintaining signal integrity.

Maximum Off-state Isolation 93 dB

High level of isolation between channels prevents signal crosstalk and interference, ensuring clean and accurate signal transmission.

Technical Specifications

Multiplexers & Switches NLAS1053USG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

SPDT

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

93 dB

Nominal On-state Resistance Match:

3 ohm

Maximum On-state Resistance (Ron):

34 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

12 ns

Maximum Switch-on Time:

12 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

NLAS1053USG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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