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NLAS4053DR2G

Onsemi

NLAS4053DR2G by Onsemi

NLAS4053DR2G by Onsemi is a CMOS multiplexer with 3 functions. It has a small outline package style and operates at temperatures ranging from -55 to 125 °C. This device is commonly used in military applications due to its temperature grade and compact size.

Median Price

$0.384

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Arrow

USA . 47 parts In-Stock

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$0.395

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$0.295

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$0.265

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DigiKey

USA . 4,546 parts In-Stock

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$0.700

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$0.388

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$0.332

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Avnet

USA . 12,500 parts In-Stock

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$0.289

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Rochester

USA . 2,810 parts In-Stock

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$0.377

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$0.313

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$0.279

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$0.279

Mouser Electronics

USA . 2,756 parts In-Stock

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Verical

USA . 2,490 parts In-Stock

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Chip1Stop

Japan . 1,568 parts In-Stock

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Digiode

USA . 1,216 parts In-Stock

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$0.214

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Nova Conductors

Japan . 500 parts In-Stock

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$0.301

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Bristol Electronics

USA . 4,449 parts In-Stock

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$0.367

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$0.274

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$0.255

4,449

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$0.367

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$0.255

Dan-Mar Components

USA . 4,449 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,634 parts In-Stock

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$0.191

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Corphita

USA . 67 parts In-Stock

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$0.202

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Corohmni

South Africa . 109 parts In-Stock

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$0.225

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Continental Prestige Electronics

USA . 4,398 parts In-Stock

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$0.301

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$0.295

Argo Parts USA

USA . 2,254 parts In-Stock

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$0.301

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$0.292

2,254

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Netroflash

USA . 100 parts In-Stock

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Vigor

Singapore . 228 parts In-Stock

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$0.760

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Microchip USA

USA . 483 parts In-Stock

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$4.460

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$4.450

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$4.450

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$4.430

483

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Aztec Data Supply Inc.

USA . 3,993 parts In-Stock

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$22.387

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Perfect Parts

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Authorized Procurement Solutions

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GreenTree Electronics

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Lixinc

USA . 10,486 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 7,621 parts In-Stock

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TANS Electronics

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SupplyDigital Components

Austria . 828 parts In-Stock

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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Kepictronics

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Overview

Experience the unparalleled quality and reliability of Onsemi with the NLAS4053DR2G multiplexer and switch. Designed with precision and innovation, this product offers a multitude of advantages for various applications. Whether it's in telecommunications, industrial control systems, or consumer electronics, the NLAS4053DR2G delivers exceptional performance. With its small outline package and surface mount capability, it provides easy integration into any design. Enjoy the benefits of efficient power management, high-speed switching, and reliable operation. Trust Onsemi's commitment to excellence and unlock new possibilities with the NLAS4053DR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving space and facilitating mass production.

No. of Functions: 3

Having multiple functions in one device increases efficiency and versatility in circuit design.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage is common and easily available, ensuring compatibility with various systems.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

The high operating temperature range makes the product suitable for industrial and harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability.

No. of Channels: 2

Having 2 channels allows for multiple signal paths, increasing flexibility in circuit routing.

Technical Specifications

Multiplexers & Switches NLAS4053DR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-5.5 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

93 dB

Nominal On-state Resistance Match:

15 ohm

Maximum On-state Resistance (Ron):

37 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3,3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.05 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NLAS4053DR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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