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NL17SZ02XV5T2G-L22087

Onsemi

NL17SZ02XV5T2G-L22087 by Onsemi

NL17SZ02XV5T2G-L22087 by Onsemi is a CMOS Logic Gate with 2 inputs, Vsup ranging from 1.65V to 5.5V, and tpd of 12ns. Ideal for applications requiring fast propagation delay, such as high-speed digital circuits in temperature-sensitive environments with operating temperatures from -55°C to 125°C.

Median Price

$0.073

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 4,000 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

USA . 3,029 parts In-Stock

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Digiode

USA . 847 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Microchip USA

USA . 11,564 parts In-Stock

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AZTECH Wire

Italy . 296 parts In-Stock

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$20.500

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Ampacity Inc.

Singapore . 3,639 parts In-Stock

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$45.000

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TANS Electronics

Latvia . 8,160 parts In-Stock

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Problanco Electronics

Mexico . 6,946 parts In-Stock

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Kulean Microsystems

USA . 4,295 parts In-Stock

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UHIMA Technologies

Türkiye . 991 parts In-Stock

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SupplyDigital Components

Austria . 796 parts In-Stock

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Corphita

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Overview

Discover the cutting-edge NL17SZ02XV5T2G-L22087 Logic Gates by Onsemi, delivering unmatched quality and reliability. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. With its advanced technology and superior performance, this logic gate ensures seamless functionality and enhanced efficiency. Trust Onsemi to provide top-notch products that exceed expectations. Elevate your projects with the NL17SZ02XV5T2G-L22087 Logic Gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates, making them suitable for various applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and allows for a more compact design in electronic circuitry.

No. of Inputs: 2

Having 2 inputs allows for more flexibility and functionality in logic operations.

Nominal Supply Voltage / Vsup (V): 2.3

The nominal supply voltage of 2.3V ensures compatibility with a wide range of power sources.

Propagation Delay (tpd): 12 ns

With a low propagation delay of 12ns, these logic gates can process signals quickly, making them suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates NL17SZ02XV5T2G-L22087 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-F5

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.047,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

12 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1.2 mm

Trade Compliance

NL17SZ02XV5T2G-L22087 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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