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NL17SG86DFT2G

Onsemi

NL17SG86DFT2G by Onsemi

NL17SG86DFT2G by Onsemi is a CMOS Logic Gate with 2 inputs, 59.4 ns propagation delay, and operates b/w -55 to 125 °C. Ideal for military-grade applications due to its small outline package style and dual terminal position.

Median Price

$0.045

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 73,406 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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$0.215

73,406

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$0.215

Rochester

USA . 72,406 parts In-Stock

1+ parts

-

100+ parts

$0.045

1k+ parts

$0.037

10k+ parts

$0.033

72,406

-

$0.045

$0.037

$0.033

Verical

USA . 72,406 parts In-Stock

1+ parts

-

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$0.042

72,406

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$0.042

Distributors (In-Stock)

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Digiode

USA . 2,320 parts In-Stock

1+ parts

$0.035

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2,320

$0.035

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Flip Electronics

USA . 11,569 parts In-Stock

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11,569

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Vyrian

USA . 7,005 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.056

6,000

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$0.056

Semtec, LLC

USA . 2,991 parts In-Stock

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2,991

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Distributors (Availability)

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Corphita

USA . 424 parts In-Stock

1+ parts

$0.033

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424

$0.033

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Corohmni

South Africa . 295 parts In-Stock

1+ parts

$0.037

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295

$0.037

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Vigor

Singapore . 330 parts In-Stock

1+ parts

$0.390

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330

$0.390

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AZTECH Wire

Italy . 810 parts In-Stock

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$20.490

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810

$20.490

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Continental Prestige Electronics

USA . 73,406 parts In-Stock

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$0.215

10k+ parts

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73,406

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$0.215

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Kepictronics

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 8,208 parts In-Stock

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TANS Electronics

Latvia . 5,640 parts In-Stock

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SupplyDigital Components

Austria . 5,359 parts In-Stock

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Kulean Microsystems

USA . 5,357 parts In-Stock

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Microchip USA

USA . 1,144 parts In-Stock

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1,144

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 524 parts In-Stock

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524

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Overview

Enhance your electronic projects with the NL17SG86DFT2G by Onsemi, a top-quality logic gate that offers superior performance and reliability. Manufactured by Onsemi, a leading name in the industry, this versatile component is perfect for a wide range of applications. Whether you're working on robotics, automation, or consumer electronics, this logic gate will provide the precision and efficiency you need. With its compact design and advanced technology, the NL17SG86DFT2G delivers unmatched value and benefits to customers, making it a must-have for any project. Upgrade your creations with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and sturdy, offering good protection for the internal components of the logic gates.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Inputs: 2

Having two inputs allows for basic logic operations to be performed, offering versatility in circuit design.

Propagation Delay (tpd): 59.4 ns

The low propagation delay ensures fast signal processing and response times in logic operations, making this product suitable for applications requiring quick decision-making.

Operating Temperature Range: -55 °C to 125°C

The wide operating temperature range makes these logic gates suitable for use in harsh environments or extreme conditions without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates energy-efficient and reliable in noise-sensitive applications.

Technical Specifications

Logic Gates NL17SG86DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SG

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

59.4 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NL17SG86DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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