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NDS9430

Onsemi

NDS9430 by Onsemi

NDS9430 by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 5.3A, 0.06 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. The transistor comes in an 8-terminal GULL WING package with METAL-OXIDE SEMICONDUCTOR technology and can withstand temperatures up to 175°C.

Median Price

$0.767

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Rochester

USA . 112,979 parts In-Stock

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-

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$0.753

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$0.625

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$0.557

112,979

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$0.753

$0.625

$0.557

Verical

USA . 42,500 parts In-Stock

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$0.781

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$0.697

42,500

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$0.781

$0.697

Distributors (In-Stock)

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Digiode

USA . 1,622 parts In-Stock

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$0.587

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Vyrian

USA . 1,167 parts In-Stock

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$0.618

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$0.618

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Component Electronics Inc.

Canada . 204 parts In-Stock

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$0.770

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$0.580

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$0.500

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204

$0.770

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DigiKey Marketplace

USA . 112,979 parts In-Stock

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$0.640

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Netsource Technology, Inc.

USA . 7,568 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 7,500 parts In-Stock

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Bristol Electronics

USA . 6,410 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,550 parts In-Stock

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Prism Electronics

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Anansix

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Corel Iberica Componentes, S.L.

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Atlantic Semiconductor

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Electronic Expediters

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PC Components Company LLC

USA . 867 parts In-Stock

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R&J Components

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ComSIT Distribution GmbH

Germany . 450 parts In-Stock

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450

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Elcom Components

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Classic Components Corporation

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Resion

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Inland Empire Components Inc.

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MRC Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 112,528 parts In-Stock

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$0.530

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Corphita

USA . 2,707 parts In-Stock

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$0.556

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Corohmni

South Africa . 74 parts In-Stock

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$0.618

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Continental Prestige Electronics

USA . 112,979 parts In-Stock

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$0.740

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Metaverse IC Inc.

Canada . 64,415 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 11,990 parts In-Stock

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SupplyDigital Components

Austria . 7,344 parts In-Stock

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Glotronic Ltd.

UK . 6,000 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 4,972 parts In-Stock

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Kulean Microsystems

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Microchip USA

USA . 4,723 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Assy Fe

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TANS Electronics

Latvia . 1,552 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 603 parts In-Stock

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UHIMA Technologies

Türkiye . 588 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NDS9430 by Onsemi. As a leading manufacturer in the industry, Onsemi offers unparalleled quality and reliability in their Small Signal Field Effect Transistors (FET). Ideal for switching applications, this P-CHANNEL transistor provides enhanced performance and efficiency. With a maximum drain current of 5.3 A and a low on resistance of 0.06 ohm, this transistor delivers exceptional power while maintaining optimal temperature control. Trust Onsemi to bring you the perfect balance of innovation and functionality with the NDS9430.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the transistor durable and resistant to external factors, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their lower ON-state resistance and higher current carrying capability, making them suitable for efficient switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse current flow, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast and efficient switching performance.

Surface Mount: YES

Being surface mountable makes the transistor easy to assemble on circuit boards, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 30 V

The high breakdown voltage ensures the transistor can handle relatively high voltages, making it versatile for a range of applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration into various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer ease of control and high input impedance, making them suitable for digital circuits and power management.

Maximum Drain Current (Abs) (ID): 5.3 A

The high maximum drain current rating allows the transistor to handle large current loads, making it reliable in high-power applications.

No. of Terminals: 8

The multiple terminals provide flexibility in circuit connections and enable the transistor to perform various functions within a circuit.

Maximum Power Dissipation (Abs): 2.5 W

With a high power dissipation rating, this transistor can handle heat effectively, ensuring stable performance under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low power consumption, high reliability, and fast switching speeds, enhancing overall performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows the transistor to operate reliably in demanding environments without overheating.

Transistor Element Material: SILICON

Silicon transistors provide good thermal stability and high breakdown voltage, ensuring reliable performance in various operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and solderability, ensuring reliable connections in the circuit.

Maximum Drain-Source On Resistance: 0.06 ohm

With a low ON resistance, the transistor minimizes power loss and heat generation, improving efficiency in switching applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and connections, providing versatility in circuit design.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly processes, ensuring a stable and robust connection.

Technical Specifications

Small Signal Field Effect Transistors (FET) NDS9430 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

5.3 A

Maximum Drain Current (ID):

5.3 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDS9430 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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