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NCV8612MNR2G

Onsemi

NCV8612MNR2G by Onsemi

NCV8612MNR2G by Onsemi is a Power Management IC with 7/18V power supplies, 20 terminals, and 0.05mA max supply current. It is used in power supply support circuits, featuring a small outline package style for surface mount applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,537 parts In-Stock

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Digiode

USA . 516 parts In-Stock

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AZTECH Wire

Italy . 1,045 parts In-Stock

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$19.980

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Component Stockers USA

USA . 738 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 7,559 parts In-Stock

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SupplyDigital Components

Austria . 4,445 parts In-Stock

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Problanco Electronics

Mexico . 2,708 parts In-Stock

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TANS Electronics

Latvia . 2,279 parts In-Stock

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Corphita

USA . 1,784 parts In-Stock

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Microchip USA

USA . 486 parts In-Stock

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UHIMA Technologies

Türkiye . 263 parts In-Stock

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Corohmni

South Africa . 197 parts In-Stock

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Overview

Enhance your power management capabilities with the NCV8612MNR2G by Onsemi. Trusted for its quality and reliability, Onsemi delivers top-notch Power Management ICs that are ideal for a wide range of applications. This small outline package offers customers the advantage of efficient surface mount installation, providing power supplies ranging from 7 to 18 volts with minimal supply current. With matte tin terminal finish and dual terminal position, this product guarantees seamless integration and exceptional performance. Upgrade your power supply support circuit today with the NCV8612MNR2G and experience the value it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly.

Power Supplies (V): 7/18

The power supplies range of 7V to 18V provides flexible voltage options for various applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact designs.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and ensures reliable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high temperatures during the assembly process.

Maximum Supply Current (Isup): 0.05 mA

The low maximum supply current of 0.05mA helps in reducing power consumption and improving efficiency.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for tighter spacing of terminals, enabling high-density PCB layouts.

Technical Specifications

Power Management ICs NCV8612MNR2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N20

JESD-609 Code:

e3

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC20,.2,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/18

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.05 mA

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NCV8612MNR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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