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NCV809SN293D1T1G

Onsemi

NCV809SN293D1T1G by Onsemi

NCV809SN293D1T1G by Onsemi is a Power Management IC with 3.3V Nominal Voltage, 1/5.5V Power Supplies range, and -40 to 105°C Operating Temperature. It is used in industrial applications for power supply support circuits due to its small outline package style and dual terminal position.

Median Price

$0.267

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 84,512 parts In-Stock

1+ parts

-

100+ parts

$0.267

1k+ parts

$0.221

10k+ parts

$0.197

84,512

-

$0.267

$0.221

$0.197

DigiKey

USA . 84,512 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.330

10k+ parts

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84,512

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-

$0.330

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Verical

USA . 47,100 parts In-Stock

1+ parts

-

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$0.247

47,100

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$0.247

Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

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45,000

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Distributors (In-Stock)

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Digiode

USA . 1,348 parts In-Stock

1+ parts

$0.208

100+ parts

-

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1,348

$0.208

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Vyrian

USA . 2,093 parts In-Stock

1+ parts

$0.219

100+ parts

-

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2,093

$0.219

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Flip Electronics

USA . 36,000 parts In-Stock

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36,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 65,851 parts In-Stock

1+ parts

$0.186

100+ parts

-

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65,851

$0.186

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Corphita

USA . 935 parts In-Stock

1+ parts

$0.197

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935

$0.197

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Corohmni

South Africa . 88 parts In-Stock

1+ parts

$0.219

100+ parts

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88

$0.219

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$25.921

100+ parts

$23.588

1k+ parts

$21.255

10k+ parts

-

3,000

$25.921

$23.588

$21.255

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Lixinc

USA . 17,894 parts In-Stock

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SupplyDigital Components

Austria . 8,208 parts In-Stock

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TANS Electronics

Latvia . 6,160 parts In-Stock

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6,160

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Problanco Electronics

Mexico . 5,885 parts In-Stock

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5,885

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Kulean Microsystems

USA . 5,827 parts In-Stock

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5,827

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Microchip USA

USA . 3,446 parts In-Stock

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3,446

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UHIMA Technologies

Türkiye . 511 parts In-Stock

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511

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Overview

Discover the unparalleled quality and reliability of the NCV809SN293D1T1G by Onsemi, a leading manufacturer of Power Management ICs. Perfect for a wide range of applications, this small outline package offers customers a valuable solution with a nominal supply voltage of 3.3V and a maximum supply voltage of 5.5V. With its industrial temperature grade and matte tin terminal finish, this power supply support circuit ensures optimal performance in any environment. Trust Onsemi's expertise and choose the NCV809SN293D1T1G for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V makes it compatible with a wide range of devices and applications.

No. of Terminals: 3

Having 3 terminals makes the product simple to integrate and reduces the complexity of the circuit design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures the reliability and stability of the product in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to operate effectively in extreme cold conditions.

Width (mm): 1.3 mm

The compact width of 1.3 mm makes the product suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh operating conditions and high temperatures.

Maximum Supply Current (Isup): 0.0025 mA

The low maximum supply current of 0.0025 mA helps in reducing power consumption and extends the battery life of devices.

Technical Specifications

Power Management ICs NCV809SN293D1T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

THRESHOLD VOLTAGE= 2.93 V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.3 mm

Trade Compliance

NCV809SN293D1T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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