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NCV803SQ308T1G

Onsemi

NCV803SQ308T1G by Onsemi

NCV803SQ308T1G by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a Small Outline package style, Matte Tin terminal finish, and operates b/w -40 to 105 °C temperature range. Ideal for power supply support circuits in compact designs.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.620

10k+ parts

$0.620

18,000

-

-

$0.620

$0.620

Flip Electronics (Authorized)

USA . 18,000 parts In-Stock

1+ parts

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18,000

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-

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Rochester

USA . 130 parts In-Stock

1+ parts

-

100+ parts

$0.267

1k+ parts

$0.221

10k+ parts

$0.197

130

-

$0.267

$0.221

$0.197

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,870 parts In-Stock

1+ parts

$0.218

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1,870

$0.218

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Vyrian

USA . 831 parts In-Stock

1+ parts

$0.230

100+ parts

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831

$0.230

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Flip Electronics

USA . 18,000 parts In-Stock

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18,000

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R&J Components

USA . 2,250 parts In-Stock

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2,250

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Distributors (Availability)

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Corphita

USA . 194 parts In-Stock

1+ parts

$0.207

100+ parts

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194

$0.207

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Vigor

Singapore . 751 parts In-Stock

1+ parts

$0.210

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751

$0.210

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Corohmni

South Africa . 295 parts In-Stock

1+ parts

$0.230

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295

$0.230

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 5,865 parts In-Stock

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5,865

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TANS Electronics

Latvia . 5,532 parts In-Stock

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Perfect Parts

USA . 5,432 parts In-Stock

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Problanco Electronics

Mexico . 3,683 parts In-Stock

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3,683

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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SupplyDigital Components

Austria . 2,266 parts In-Stock

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2,266

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Microchip USA

USA . 381 parts In-Stock

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381

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UHIMA Technologies

Türkiye . 206 parts In-Stock

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206

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Overview

Enhance your power management capabilities with the NCV803SQ308T1G by Onsemi. Designed with quality and precision, this Power Management IC offers unparalleled reliability and efficiency for a range of applications. With Onsemi's reputation for excellence in manufacturing, you can trust that this product delivers exceptional performance and longevity. Whether you're looking to optimize energy consumption or improve system stability, the NCV803SQ308T1G provides value, benefits, and advantages that will exceed your expectations. Upgrade your power management solutions today and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a durable and lightweight package for the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used supply voltage, making it compatible with a wide range of systems and applications.

No. of Terminals: 3

Having a small number of terminals simplifies the design and reduces potential points of failure.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the IC to withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the IC to function in both extreme cold and hot environments.

Width (mm): 1.24 mm

Compact width size enables high-density mounting on PCBs, saving valuable space in electronic devices.

Minimum Supply Voltage (Vsup): 1.2 V

Low minimum supply voltage allows for efficient power management and extends battery life in portable devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in demanding environments.

Maximum Supply Current (Isup): 0.0025 mA

Low supply current consumption results in energy-efficient operation and reduces power wastage.

Technical Specifications

Power Management ICs NCV803SQ308T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP3/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.24 mm

Trade Compliance

NCV803SQ308T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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