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NCV803SQ308D2T1G

Onsemi

NCV803SQ308D2T1G by Onsemi

NCV803SQ308D2T1G by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for automotive applications. It features a small outline package style, matte tin terminal finish, and operates in temperatures ranging from -40 to 125 °C. This IC supports power supplies of 1.5/5V and has a max seated height of 1mm.

Median Price

$0.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,538 parts In-Stock

1+ parts

$0.610

100+ parts

$0.306

1k+ parts

$0.184

10k+ parts

$0.138

2,538

$0.610

$0.306

$0.184

$0.138

DigiKey

USA . 1,850 parts In-Stock

1+ parts

$0.620

100+ parts

$0.305

1k+ parts

$0.197

10k+ parts

$0.138

1,850

$0.620

$0.305

$0.197

$0.138

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

3,000

-

-

-

$0.146

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 810 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

-

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810

$0.146

-

-

-

Digiode

USA . 859 parts In-Stock

1+ parts

$0.542

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$0.542

-

-

-

Flip Electronics

USA . 71,999 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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71,999

-

-

-

-

TME

Poland . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

3,000

-

-

-

$0.167

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 435 parts In-Stock

1+ parts

$0.146

100+ parts

-

1k+ parts

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435

$0.146

-

-

-

Corphita

USA . 1,738 parts In-Stock

1+ parts

$0.513

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

$0.513

-

-

-

Component Stockers USA

USA . 42,917 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

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10k+ parts

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42,917

$2.670

-

-

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iodParts Technologies Inc.

India . 45,000 parts In-Stock

1+ parts

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100+ parts

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45,000

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Problanco Electronics

Mexico . 8,241 parts In-Stock

1+ parts

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8,241

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QUARKTWIN TECHNOLOGY LTD

USA . 6,183 parts In-Stock

1+ parts

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6,183

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TANS Electronics

Latvia . 6,165 parts In-Stock

1+ parts

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6,165

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SupplyDigital Components

Austria . 3,098 parts In-Stock

1+ parts

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3,098

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 2,212 parts In-Stock

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2,212

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Microchip USA

USA . 1,148 parts In-Stock

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1,148

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Perfect Parts

USA . 896 parts In-Stock

1+ parts

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896

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UHIMA Technologies

Türkiye . 687 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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687

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-

Overview

Enhance your power management solutions with the NCV803SQ308D2T1G by Onsemi. Manufactured with top-quality materials and cutting-edge technology, this Power Management IC offers reliability and efficiency like no other. Ideal for automotive applications, this small outline, very thin profile device provides a nominal supply voltage of 3.3V and a maximum supply current of 0.0025mA. Trust Onsemi to deliver the best in Power Management ICs, providing you with the value, benefits, and advantages you need to stay ahead in the game.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures good protection and long-term reliability of the product.

Surface Mount: YES

The surface mount capability makes it easy to integrate this power management IC into various electronic devices and PCBs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage is common and widely compatible with many electronic systems and components.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 125 °C allows this IC to function reliably in various environmental conditions.

Maximum Seated Height: 1 mm

The low profile design with a maximum seated height of 1mm enables space-efficient integration into compact electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature range ensures high reliability and performance in automotive applications where temperature fluctuations are common.

Maximum Supply Current (Isup): 0.0025 mA

The low supply current requirement of only 0.0025 mA helps in optimizing power efficiency and extending battery life in portable devices.

Technical Specifications

Power Management ICs NCV803SQ308D2T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP3/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.24 mm

Trade Compliance

NCV803SQ308D2T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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