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NCV809RTRG

Onsemi

NCV809RTRG by Onsemi

NCV809RTRG by Onsemi is a Power Management IC with 3.3V Nominal Voltage, suitable for industrial applications. It features a small outline package style, matte tin terminal finish, and operates b/w -40 to 105 °C. Ideal for power supply support circuits in various electronic devices.

Median Price

$0.293

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57,104 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.263

10k+ parts

$0.235

57,104

-

$0.317

$0.263

$0.235

DigiKey

USA . 57,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

57,104

-

-

-

$0.270

Verical

USA . 57,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.293

57,104

-

-

-

$0.293

Flip Electronics (Authorized)

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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30,000

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,229 parts In-Stock

1+ parts

$0.247

100+ parts

-

1k+ parts

-

10k+ parts

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1,229

$0.247

-

-

-

Vyrian

USA . 1,376 parts In-Stock

1+ parts

$0.260

100+ parts

-

1k+ parts

-

10k+ parts

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1,376

$0.260

-

-

-

Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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30,000

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,246 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

2,246

$0.234

-

-

-

Corohmni

South Africa . 454 parts In-Stock

1+ parts

$0.260

100+ parts

-

1k+ parts

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10k+ parts

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454

$0.260

-

-

-

Ampacity Inc.

Singapore . 47,574 parts In-Stock

1+ parts

$0.481

100+ parts

-

1k+ parts

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10k+ parts

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47,574

$0.481

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$2.745

100+ parts

$2.498

1k+ parts

$2.251

10k+ parts

-

100

$2.745

$2.498

$2.251

-

Kulean Microsystems

USA . 5,704 parts In-Stock

1+ parts

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100+ parts

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5,704

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Problanco Electronics

Mexico . 1,760 parts In-Stock

1+ parts

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1,760

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TANS Electronics

Latvia . 943 parts In-Stock

1+ parts

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943

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UHIMA Technologies

Türkiye . 436 parts In-Stock

1+ parts

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436

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SupplyDigital Components

Austria . 267 parts In-Stock

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267

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Vigor

Singapore . 187 parts In-Stock

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187

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Microchip USA

USA . 113 parts In-Stock

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113

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Overview

Elevate your power management capabilities with the NCV809RTRG by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures optimal performance and efficiency. Experience the seamless integration of advanced technology and innovative design, providing you with the value and benefits you need to elevate your projects. Trust in Onsemi's legacy of excellence and choose the NCV809RTRG for superior power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications and compatible with many devices requiring this voltage.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of functioning even in very low temperatures, ensuring reliable performance in various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Power Management ICs NCV809RTRG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.9 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.63V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

NCV809RTRG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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