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NCV8408DTRKG

Onsemi

NCV8408DTRKG by Onsemi

NCV8408DTRKG by Onsemi is a peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal output peak current limit of 13A and turn-on time of 20us. This IC is ideal for automotive applications requiring buffer or inverter based peripheral drivers.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 9 parts In-Stock

1+ parts

$1.320

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-

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$0.594

9

$1.320

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$0.594

Distributors (In-Stock)

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Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$0.448

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38

$0.448

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Digiode

USA . 1,421 parts In-Stock

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$1.454

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1,421

$1.454

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Chip Stock

USA . 37,749 parts In-Stock

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Vyrian

USA . 2,504 parts In-Stock

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2,504

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Distributors (Availability)

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Corphita

USA . 1,246 parts In-Stock

1+ parts

$1.377

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1,246

$1.377

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Corohmni

South Africa . 128 parts In-Stock

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$1.530

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128

$1.530

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Perfect Parts

USA . 23,840 parts In-Stock

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23,840

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Problanco Electronics

Mexico . 6,468 parts In-Stock

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6,468

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SupplyDigital Components

Austria . 6,013 parts In-Stock

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6,013

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A-Z Elektronik GmbH

Germany . 5,852 parts In-Stock

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5,852

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TANS Electronics

Latvia . 5,430 parts In-Stock

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5,430

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Kulean Microsystems

USA . 3,203 parts In-Stock

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Microchip USA

USA . 2,895 parts In-Stock

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2,895

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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799

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Kepictronics

USA . 499 parts In-Stock

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499

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Vigor

Singapore . 155 parts In-Stock

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155

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Overview

Enhance your electronic designs with the NCV8408DTRKG from Onsemi, a leading manufacturer known for quality and reliability. This peripheral driver offers built-in protections against transient events, over current, over voltage, and thermal issues, ensuring your devices are safeguarded at all times. With its small outline package style and gull wing terminal form, this product is versatile and easy to integrate into various applications. Experience the value of seamless performance and peace of mind with the NCV8408DTRKG, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the peripheral driver, ensuring a longer lifespan.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Multiple built-in protections ensure the peripheral driver can handle various unexpected events, increasing reliability and safety.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient soldering during assembly, improving the overall quality of the product.

Nominal Output Peak Current Limit: 13 A

High current limit allows the peripheral driver to handle demanding applications and devices, making it a versatile choice.

Technical Specifications

Peripheral Drivers NCV8408DTRKG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

13 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.38 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

60 us

Turn-on Time:

20 us

Width:

6.095 mm

Trade Compliance

NCV8408DTRKG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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