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NCV7471CDQ5R2G

Onsemi

NCV7471CDQ5R2G by Onsemi

NCV7471CDQ5R2G by Onsemi is a dual-function network interface with CAN FD and LIN transceivers. It operates at 5V, supports data rates up to 2 Mbps, and is AEC-Q100 qualified for automotive applications. The package style is small outline with a max operating temperature of 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,475 parts In-Stock

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9,475

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Digiode

USA . 2,270 parts In-Stock

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2,270

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Distributors (Availability)

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Vigor

Singapore . 400 parts In-Stock

1+ parts

$2.670

100+ parts

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400

$2.670

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AZTECH Wire

Italy . 947 parts In-Stock

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$17.470

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947

$17.470

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QUARKTWIN TECHNOLOGY LTD

USA . 22,400 parts In-Stock

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22,400

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Problanco Electronics

Mexico . 6,837 parts In-Stock

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6,837

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SupplyDigital Components

Austria . 6,643 parts In-Stock

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6,643

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TANS Electronics

Latvia . 5,188 parts In-Stock

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5,188

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Kulean Microsystems

USA . 3,495 parts In-Stock

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3,495

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Corphita

USA . 2,235 parts In-Stock

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2,235

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 736 parts In-Stock

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736

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Microchip USA

USA . 340 parts In-Stock

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340

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Corohmni

South Africa . 178 parts In-Stock

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178

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Overview

Experience seamless communication with the NCV7471CDQ5R2G by Onsemi, a top-tier network interface designed to elevate your automotive applications. Manufactured with precision and reliability, this product offers unparalleled value with its advanced technology and high-quality components. Say goodbye to connectivity issues and hello to optimized performance, thanks to its dual transceivers for CAN FD and LIN protocols. Upgrade your systems today and experience the difference with the NCV7471CDQ5R2G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and making the overall design more compact.

No. of Functions: 2

Having two functions in one device increases versatility and functionality, providing more value for the user.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for reliability and quality, making it a reliable choice for automotive applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the product can perform reliably in high-temperature environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in a wide range of environments, including those with extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish ensures good conductivity, corrosion resistance, and durability, extending the lifespan of the product.

Width: 7.5 mm

With a compact width, this product can fit into tight spaces and crowded circuit boards, allowing for more efficient design layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during the manufacturing process, ensuring proper connection and functionality.

Data Rate: 2 Mbps

With a high data rate of 2 Mbps, this product can transmit data quickly and efficiently, making it suitable for high-speed applications.

Technical Specifications

Network Interfaces NCV7471CDQ5R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

36

No. of Transceivers:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NCV7471CDQ5R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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