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NCV70514MW003G

Onsemi

NCV70514MW003G by Onsemi

NCV70514MW003G by Onsemi is a Motion Control IC with 32 terminals, suitable for Stepper Motor Control. It operates b/w 6-29V and has a compact square package shape measuring 5x5mm, making it ideal for applications requiring precise motion control in limited space.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,094 parts In-Stock

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Digiode

USA . 1,701 parts In-Stock

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AZTECH Wire

Italy . 427 parts In-Stock

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$8.490

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Problanco Electronics

Mexico . 7,412 parts In-Stock

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SupplyDigital Components

Austria . 5,211 parts In-Stock

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Kulean Microsystems

USA . 3,862 parts In-Stock

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TANS Electronics

Latvia . 2,465 parts In-Stock

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Corphita

USA . 1,952 parts In-Stock

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Corohmni

South Africa . 441 parts In-Stock

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Microchip USA

USA . 269 parts In-Stock

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UHIMA Technologies

Türkiye . 125 parts In-Stock

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Overview

Unlock the power of motion control with the NCV70514MW003G by Onsemi. Designed with precision and reliability in mind, this stepper motor controller offers unparalleled performance for a wide range of applications. From robotics to automotive systems, this surface mount IC provides seamless operation and superior efficiency. Trust in Onsemi's expertise in motion control ICs to deliver exceptional quality and value. Experience the difference with the NCV70514MW003G and elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, reducing assembly time and effort.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications where board real estate is limited.

Nominal Supply Voltage (Vsup): 14 V

The 14V supply voltage ensures compatibility with a wide range of applications while providing sufficient power for optimal performance.

No. of Terminals: 32

Having 32 terminals allows for a greater degree of connectivity and control options, making the product versatile and adaptable to different systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and space-saving attributes for improved performance and reliability.

Terminal Position: QUAD

Quad terminal position offers a robust and secure connection, ensuring stable operation under varying conditions.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, the product can be easily integrated into compact devices and systems without compromising space constraints.

Width (mm): 5 mm

The narrow width of 5mm allows for a streamlined design, making it suitable for applications where space efficiency is crucial.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller adds value to the product as it enables precise control and operation of stepper motors, making it suitable for motion control applications.

Minimum Supply Voltage (Vsup): 6 V

The minimum supply voltage of 6V ensures compatibility with systems that require lower power input, providing flexibility in various operating environments.

Length: 5 mm

The compact length of 5mm contributes to the overall small form factor of the product, making it ideal for applications with space constraints.

Terminal Form: NO LEAD

The no-lead terminal form offers a reliable and robust connection, reducing the risk of solder joint failures and enhancing long-term reliability.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting, enabling more connections in a limited space and increasing overall functionality.

Maximum Supply Voltage (Vsup): 29 V

The 29V maximum supply voltage provides a wide operating range, accommodating applications that require higher power levels for enhanced performance.

Technical Specifications

Motion Control ICs NCV70514MW003G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

NCV70514MW003G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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