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NCV451AMNWTBG

Onsemi

NCV451AMNWTBG by Onsemi

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

Median Price

$0.498

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,044 parts In-Stock

1+ parts

$0.900

100+ parts

$0.510

1k+ parts

$0.424

10k+ parts

$0.396

4,044

$0.900

$0.510

$0.424

$0.396

Rochester

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.406

10k+ parts

$0.362

17,000

-

$0.489

$0.406

$0.362

Verical

USA . 17,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.507

10k+ parts

$0.452

17,000

-

-

$0.507

$0.452

DigiKey

USA . 808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

808

-

-

-

$0.397

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,034 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$0.380

-

-

-

Vyrian

USA . 1,402 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$0.400

-

-

-

Nova Conductors

Japan . 42 parts In-Stock

1+ parts

-

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-

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42

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,082 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

-

10k+ parts

-

19,082

$0.340

-

-

-

Corphita

USA . 678 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

678

$0.360

-

-

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$0.360

-

-

-

Microchip USA

USA . 4,084 parts In-Stock

1+ parts

$2.508

100+ parts

-

1k+ parts

-

10k+ parts

-

4,084

$2.508

-

-

-

TANS Electronics

Latvia . 7,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

7,700

-

-

-

-

Problanco Electronics

Mexico . 7,337 parts In-Stock

1+ parts

-

100+ parts

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7,337

-

-

-

-

SupplyDigital Components

Austria . 6,823 parts In-Stock

1+ parts

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100+ parts

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6,823

-

-

-

-

Kulean Microsystems

USA . 4,744 parts In-Stock

1+ parts

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100+ parts

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4,744

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-

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RC Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

-

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UHIMA Technologies

Türkiye . 735 parts In-Stock

1+ parts

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100+ parts

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735

-

-

-

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Lixinc

USA . 177 parts In-Stock

1+ parts

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100+ parts

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177

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-

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-

Technical Specifications

Peripheral Drivers NCV451AMNWTBG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

.75 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NCV451AMNWTBG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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