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NCV47822PAAJR2G

Onsemi

NCV47822PAAJR2G by Onsemi

Onsemi's NCV47822PAAJR2G is a Peripheral Driver with 14 terminals, operating voltage range of 4.4V to 40V, and built-in protections against over current and thermal issues. Ideal for automotive applications due to AEC-Q100 screening level, it features a small outline package with thin profile and shrink pitch design. With a max output current of 0.25A, this buffer or inverter based driver is suitable for various automotive electronic systems.

Median Price

$1.730

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 3 parts In-Stock

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$0.641

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$0.641

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Chip1Stop

Japan . 3 parts In-Stock

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$1.730

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$1.730

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Farnell

UK . 1,494 parts In-Stock

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$2.210

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$1.170

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$0.894

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$0.871

1,494

$2.210

$1.170

$0.894

$0.871

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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Digiode

USA . 572 parts In-Stock

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$1.088

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$1.088

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Nova Conductors

Japan . 300 parts In-Stock

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$2.071

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Bristol Electronics

USA . 95 parts In-Stock

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$2.700

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$1.674

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Sensible Micro Corp

USA . 16,488 parts In-Stock

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Chip Stock

USA . 6,400 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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$0.646

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IBS Electronics

USA . 5,000 parts In-Stock

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$0.611

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$0.611

Flip Electronics

USA . 2,500 parts In-Stock

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Vyrian

USA . 1,918 parts In-Stock

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Martec Srl

Italy . 512 parts In-Stock

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Microfarads

USA . 90 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,106 parts In-Stock

1+ parts

$0.600

100+ parts

$0.585

1k+ parts

$0.582

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2,106

$0.600

$0.585

$0.582

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Ampacity Inc.

Singapore . 1,871 parts In-Stock

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$0.600

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Corohmni

South Africa . 201 parts In-Stock

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$0.940

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$0.940

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Corphita

USA . 2,408 parts In-Stock

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$1.030

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$1.030

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Continental Prestige Electronics

USA . 4,721 parts In-Stock

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$2.071

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$2.030

4,721

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Argo Parts USA

USA . 1,621 parts In-Stock

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$2.071

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Vigor

Singapore . 290 parts In-Stock

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$2.270

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Microchip USA

USA . 3,503 parts In-Stock

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$8.066

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iodParts Technologies Inc.

India . 25,000 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Kulean Microsystems

USA . 7,276 parts In-Stock

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SupplyDigital Components

Austria . 7,028 parts In-Stock

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Lixinc

USA . 6,589 parts In-Stock

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TANS Electronics

Latvia . 5,883 parts In-Stock

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Problanco Electronics

Mexico . 1,224 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Futuretech Components

Singapore . 673 parts In-Stock

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UHIMA Technologies

Türkiye . 641 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 512 parts In-Stock

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Component Connect

USA . 512 parts In-Stock

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Infinite Electronics LLP (Excess)

. 312 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Experience the premium quality and reliability of Onsemi with the NCV47822PAAJR2G peripheral driver. Designed for automotive applications, this compact and efficient device offers built-in protections against over current and thermal issues. With a wide supply voltage range and high output current capability, this versatile driver ensures optimal performance in a variety of scenarios. Trust Onsemi for cutting-edge solutions that deliver unmatched value and performance to meet your specific needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable packaging for the peripheral driver.

Maximum Supply Voltage: 40 V

Allows for compatibility with a wide range of voltage requirements in different applications.

Package Shape: RECTANGULAR

Compact rectangular shape for efficient use of space in electronic circuits.

Built-in Protections: OVER CURRENT; THERMAL

Ensures the peripheral driver is protected from potential damage due to overcurrent or overheating.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and performance.

Technical Specifications

Peripheral Drivers NCV47822PAAJR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Nominal Output Peak Current Limit:

.35 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCV47822PAAJR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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