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NCV47722DAJR2G

Onsemi

NCV47722DAJR2G by Onsemi

NCV47722DAJR2G by Onsemi is a peripheral driver with a max supply voltage of 40V, built-in protections for over current and thermal issues, and an output current of 0.25A. It is designed for automotive applications requiring a small outline package style and operates within a temperature range of -40 to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,180 parts In-Stock

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Vyrian

USA . 388 parts In-Stock

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Kulean Microsystems

USA . 5,802 parts In-Stock

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TANS Electronics

Latvia . 4,029 parts In-Stock

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Problanco Electronics

Mexico . 1,923 parts In-Stock

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Corphita

USA . 1,503 parts In-Stock

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SupplyDigital Components

Austria . 1,345 parts In-Stock

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UHIMA Technologies

Türkiye . 703 parts In-Stock

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Corohmni

South Africa . 471 parts In-Stock

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Overview

Enhance your automotive applications with the NCV47722DAJR2G by Onsemi, a high-quality peripheral driver designed to deliver exceptional performance and reliability. With built-in protections against over current and thermal issues, this product ensures safety and longevity in various electronic systems. Its small outline package and wide temperature range make it ideal for automotive environments, offering customers peace of mind knowing their devices are well-protected. Trust Onsemi's reputation for excellence and elevate your projects with the NCV47722DAJR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the peripheral driver, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 40 V

High maximum supply voltage allows the peripheral driver to be used in a wide range of applications without the risk of overloading.

Built-in Protections: OVER CURRENT; THERMAL

Built-in protections against over current and thermal issues enhance the safety and reliability of the peripheral driver, protecting both the driver itself and the connected devices.

Maximum Output Current: 0.25 A

The high maximum output current of 0.25 A allows the peripheral driver to power multiple devices simultaneously or drive devices with higher power requirements.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures that the peripheral driver can operate effectively in automotive environments with varying temperature conditions.

Technical Specifications

Peripheral Drivers NCV47722DAJR2G attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G8

Length:

3.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-on Time:

25 us

Width:

4.9 mm

Trade Compliance

NCV47722DAJR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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