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NCV47722MNWTXG

Onsemi

NCV47722MNWTXG by Onsemi

NCV47722MNWTXG by Onsemi is a Peripheral Driver with 8 terminals, operating voltage range of 4.4-40 V, and built-in protections against over current and thermal issues. Ideal for automotive applications due to AEC-Q100 screening level, it features a small outline package with very thin profile and turn-on time of 25 us.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,278 parts In-Stock

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Digiode

USA . 979 parts In-Stock

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979

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,971 parts In-Stock

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Problanco Electronics

Mexico . 5,439 parts In-Stock

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TANS Electronics

Latvia . 4,647 parts In-Stock

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Kulean Microsystems

USA . 4,252 parts In-Stock

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Corphita

USA . 1,379 parts In-Stock

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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800

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Corohmni

South Africa . 160 parts In-Stock

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Overview

Elevate your electronic designs with the NCV47722MNWTXG by Onsemi. This high-quality peripheral driver offers built-in protections against over current and thermal issues, ensuring reliable performance in automotive applications. With a wide operating temperature range and a compact package design, this product delivers value and efficiency to customers seeking top-notch solutions for their projects. Trust in Onsemi's reputation for excellence and choose the NCV47722MNWTXG for all your driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Maximum Supply Voltage: 40 V

Allows the peripheral driver to handle higher voltage inputs, making it suitable for a variety of applications.

Built-in Protections: OVER CURRENT; THERMAL

Ensures the safety of the peripheral driver and connected devices by preventing damage from overcurrent or excessive heat.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without compromising performance, ideal for automotive applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in harsh environmental conditions.

Technical Specifications

Peripheral Drivers NCV47722MNWTXG attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

4.4 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-on Time:

25 us

Width:

3 mm

Trade Compliance

NCV47722MNWTXG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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