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NCP803SN308T1

Onsemi

NCP803SN308T1 by Onsemi

NCP803SN308T1 by Onsemi is a Power Management IC with 3.3V nominal voltage, 1.5/5V power supplies, and -40 to 105 °C operating temperature range. It is used in industrial applications for power supply support circuits due to its small outline, thin profile package style, and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 15,499 parts In-Stock

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Vyrian

USA . 8,995 parts In-Stock

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Bristol Electronics

USA . 2,730 parts In-Stock

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2,730

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Atlantic Semiconductor

USA . 2,730 parts In-Stock

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Digiode

USA . 1,928 parts In-Stock

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Vigor

Singapore . 500 parts In-Stock

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$0.430

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500

$0.430

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Advanced Electronics

New Zealand . 870 parts In-Stock

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$8.956

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$8.150

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$7.344

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870

$8.956

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$7.344

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AZTECH Wire

Italy . 159 parts In-Stock

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$21.500

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159

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Component Stockers USA

USA . 509 parts In-Stock

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$99.990

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RC Electronics

USA . 18,000 parts In-Stock

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TANS Electronics

Latvia . 6,526 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kulean Microsystems

USA . 2,063 parts In-Stock

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Problanco Electronics

Mexico . 2,054 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 579 parts In-Stock

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Corohmni

South Africa . 360 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 315 parts In-Stock

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Kepictronics

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Overview

Enhance your power management with the NCP803SN308T1 by Onsemi. Trusted for its superior quality and reliability, Onsemi delivers top-of-the-line Power Management ICs that exceed expectations. Ideal for a variety of applications, this small outline, thin profile IC offers a nominal supply voltage of 3.3V and a minimum operating temperature of -40 °C, making it perfect for industrial use. Experience the benefits of efficient power supply support and precise threshold voltage control with the NCP803SN308T1. Upgrade your systems today with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the Power Management IC, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable makes it easy to integrate this Power Management IC into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

A compatible nominal supply voltage of 3.3V allows for seamless integration with standard power systems, making it versatile and widely applicable.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105 °C, this Power Management IC can withstand elevated temperatures without compromising performance, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C ensures functionality even in harsh environmental conditions, making it reliable in various settings.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, facilitating a strong and reliable connection for optimal performance.

Width (mm): 1.3 mm

The compact width of 1.3mm allows for a space-efficient design, ideal for applications where size constraints are a concern.

Minimum Supply Voltage (Vsup): 1.2 V

Support for a minimum supply voltage of 1.2V ensures compatibility with low-power systems, offering flexibility in power requirements.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this Power Management IC meets the stringent requirements and reliability standards of industrial environments, ensuring robust performance.

Maximum Supply Current (Isup): 0.0025 mA

With a low maximum supply current of 0.0025mA, this Power Management IC helps in achieving energy efficiency and minimizing power consumption.

Terminal Pitch: 0.95 mm

The narrow terminal pitch of 0.95mm allows for closer placement of terminals on the IC, enabling higher density circuit designs and efficient use of board space.

Maximum Supply Voltage (Vsup): 5.5 V

Support for a maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources, offering flexibility in power input options.

Technical Specifications

Power Management ICs NCP803SN308T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

1.3 mm

Trade Compliance

NCP803SN308T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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