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NCP803SN120T1G

Onsemi

NCP803SN120T1G by Onsemi

NCP803SN120T1G by Onsemi is a Power Management IC with 3.3V nominal voltage, 1.2/5.5V power supplies, and -40 to 105 °C operating temperature range. It is used in industrial applications for power supply support circuits due to its small outline package style and CMOS technology.

Median Price

$0.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 19 parts In-Stock

1+ parts

$0.580

100+ parts

$0.363

1k+ parts

$0.224

10k+ parts

-

19

$0.580

$0.363

$0.224

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 427 parts In-Stock

1+ parts

$0.551

100+ parts

-

1k+ parts

-

10k+ parts

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427

$0.551

-

-

-

Flip Electronics

USA . 171,000 parts In-Stock

1+ parts

-

100+ parts

-

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171,000

-

-

-

-

Chip Stock

USA . 7,500 parts In-Stock

1+ parts

-

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7,500

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-

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Vyrian

USA . 5,782 parts In-Stock

1+ parts

-

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-

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5,782

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

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19

$0.493

-

-

-

Corphita

USA . 326 parts In-Stock

1+ parts

$0.522

100+ parts

-

1k+ parts

-

10k+ parts

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326

$0.522

-

-

-

Corohmni

South Africa . 78 parts In-Stock

1+ parts

$0.580

100+ parts

-

1k+ parts

-

10k+ parts

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78

$0.580

-

-

-

Vigor

Singapore . 492 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

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10k+ parts

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492

$0.630

-

-

-

Perfect Parts

USA . 60,480 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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60,480

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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10,000

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SupplyDigital Components

Austria . 7,360 parts In-Stock

1+ parts

-

100+ parts

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7,360

-

-

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Problanco Electronics

Mexico . 6,895 parts In-Stock

1+ parts

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100+ parts

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6,895

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TANS Electronics

Latvia . 6,196 parts In-Stock

1+ parts

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100+ parts

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6,196

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-

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,000

-

-

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

1+ parts

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100+ parts

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6,000

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Kulean Microsystems

USA . 5,186 parts In-Stock

1+ parts

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5,186

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QUARKTWIN TECHNOLOGY LTD

USA . 4,324 parts In-Stock

1+ parts

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4,324

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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3,000

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-

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Microchip USA

USA . 760 parts In-Stock

1+ parts

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100+ parts

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760

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Futuretech Components

Singapore . 682 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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682

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UHIMA Technologies

Türkiye . 580 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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580

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Overview

Experience reliable and efficient power management with the NCP803SN120T1G by Onsemi. This innovative Power Management IC offers exceptional quality and performance, designed for industrial-grade applications. With a compact design and a wide operating temperature range, this product ensures superior functionality in various environments. Trust Onsemi's expertise in semiconductor manufacturing to deliver cutting-edge solutions for your power supply needs. Upgrade your systems with the NCP803SN120T1G and benefit from its advanced features and reliable performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in power management ICs for its durability and reliability, ensuring the product can withstand various operating conditions.

Surface Mount: YES

Being surface mountable makes this IC easy to integrate onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 3.3 V

This specific voltage requirement makes the IC compatible with a wide range of devices and applications that operate within the 3.3V range.

Power Supplies (V): 1.2/5.5

The ability to support a range of power supplies from 1.2V to 5.5V allows flexibility in design and compatibility with different power sources.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this IC can perform reliably even in environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures the IC can function effectively in a variety of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy efficient and reliable in signal processing.

Technical Specifications

Power Management ICs NCP803SN120T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.20V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.2V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.3 mm

Trade Compliance

NCP803SN120T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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