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NCP802SN1T1G

Onsemi

NCP802SN1T1G by Onsemi

NCP802SN1T1G by Onsemi is a Power Management IC with 6 terminals, Vsup ranging from 1.5V to 5V, and operating temperature of -40 to 85 °C. It is used in industrial applications for power supply support circuits due to its small outline package style and surface mount capability.

Median Price

$0.391

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 49 parts In-Stock

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$0.391

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49

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Digiode

USA . 1,847 parts In-Stock

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Vyrian

USA . 997 parts In-Stock

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997

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Distributors (Availability)

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Corohmni

South Africa . 480 parts In-Stock

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$0.391

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480

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Kulean Microsystems

USA . 8,166 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Problanco Electronics

Mexico . 6,395 parts In-Stock

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6,395

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TANS Electronics

Latvia . 5,612 parts In-Stock

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SupplyDigital Components

Austria . 5,395 parts In-Stock

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RC Electronics

USA . 2,700 parts In-Stock

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Corphita

USA . 1,320 parts In-Stock

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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700

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Futuretech Components

Singapore . 682 parts In-Stock

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682

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Overview

Unlock the power of efficient and reliable power management with the NCP802SN1T1G by Onsemi. Manufactured by a trusted industry leader, this Power Management IC offers unparalleled quality and performance. Ideal for a wide range of applications, this compact and versatile device provides customers with a seamless and optimized power supply support circuit. Experience the benefits of superior manufacturing standards, advanced technology, and exceptional value with the NCP802SN1T1G - the perfect solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product.

Surface Mount: YES

This feature allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage (Vsup): 3 V

Suitable for powering various electronic devices without risking damage due to high voltage.

No. of Terminals: 6

Provides sufficient connection options for different circuits and components.

Maximum Operating Temperature: 85 °C

Can operate efficiently in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Ensures the product can function in extreme cold temperatures as well.

Width (mm): 1.625 mm

Compact size allows for easy integration into space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management applications, ensuring optimal performance.

Technical Specifications

Power Management ICs NCP802SN1T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e2

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.625 mm

Trade Compliance

NCP802SN1T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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