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NCP803SN463T1G

Onsemi

NCP803SN463T1G by Onsemi

NCP803SN463T1G by Onsemi is a Power Management IC with 3.3V nominal voltage, suitable for industrial applications. It features a small outline package style, matte tin terminal finish, and operates b/w -40 to 105 °C. Ideal for power supply support circuits with Vsup ranging from 1.2V to 5.5V.

Median Price

$0.183

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

1+ parts

$0.323

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2

$0.323

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Rochester

USA . 71,991 parts In-Stock

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-

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$0.228

1k+ parts

$0.189

10k+ parts

$0.168

71,991

-

$0.228

$0.189

$0.168

Verical

USA . 66,947 parts In-Stock

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$0.210

66,947

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$0.210

Mouser Electronics

USA . 15,938 parts In-Stock

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$0.173

15,938

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$0.173

DigiKey

USA . 15,000 parts In-Stock

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$0.183

15,000

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$0.183

Future Electronics

Canada . 6,000 parts In-Stock

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$0.138

6,000

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$0.138

Chip1Stop

Japan . 2,170 parts In-Stock

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$0.102

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$0.091

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2,170

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$0.102

$0.091

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.259

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300

$0.259

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Digiode

USA . 976 parts In-Stock

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$0.266

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976

$0.266

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Chip Stock

USA . 24,500 parts In-Stock

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Bristol Electronics

USA . 17,485 parts In-Stock

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Atlantic Semiconductor

USA . 17,485 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Vyrian

USA . 4,858 parts In-Stock

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Goldney Electronics S.L.

Spain . 4,000 parts In-Stock

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Elcom Components

USA . 3,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,286 parts In-Stock

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2,286

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ComSIT Distribution GmbH

Germany . 1,794 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 5,158 parts In-Stock

1+ parts

$0.087

100+ parts

$0.085

1k+ parts

$0.084

10k+ parts

-

5,158

$0.087

$0.085

$0.084

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Ampacity Inc.

Singapore . 4,852 parts In-Stock

1+ parts

$0.087

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4,852

$0.087

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Corohmni

South Africa . 493 parts In-Stock

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$0.154

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493

$0.154

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Corphita

USA . 919 parts In-Stock

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$0.252

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919

$0.252

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Argo Parts USA

USA . 4,782 parts In-Stock

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$0.259

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$0.251

4,782

$0.259

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$0.251

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$0.259

100+ parts

$0.246

1k+ parts

$0.234

10k+ parts

$0.231

500

$0.259

$0.246

$0.234

$0.231

Continental Prestige Electronics

USA . 2,821 parts In-Stock

1+ parts

$0.383

100+ parts

$0.293

1k+ parts

$0.175

10k+ parts

$0.123

2,821

$0.383

$0.293

$0.175

$0.123

Vigor

Singapore . 750 parts In-Stock

1+ parts

$0.580

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750

$0.580

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Aztec Data Supply Inc.

USA . 3,119 parts In-Stock

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$12.960

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3,119

$12.960

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.684

100+ parts

$20.642

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$18.601

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$22.684

$20.642

$18.601

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Kepictronics

USA . 30,000 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 12,373 parts In-Stock

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Kulean Microsystems

USA . 6,824 parts In-Stock

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Perfect Parts

USA . 6,411 parts In-Stock

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TANS Electronics

Latvia . 4,613 parts In-Stock

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SupplyDigital Components

Austria . 3,590 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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Problanco Electronics

Mexico . 919 parts In-Stock

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Computer Components Inc. - USA

USA . 828 parts In-Stock

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Futuretech Components

Singapore . 682 parts In-Stock

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682

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UHIMA Technologies

Türkiye . 657 parts In-Stock

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657

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Overview

Discover the NCP803SN463T1G by Onsemi, a top-tier Power Management IC designed for efficiency and reliability. Manufactured by Onsemi, a trusted industry leader, this product offers unparalleled quality and performance. With applications in power supply support circuits, this compact IC delivers a nominal threshold voltage of +4.63V, making it ideal for industrial use. Benefit from its small outline, thin profile package style and dual terminal position for easy integration into your systems. Trust Onsemi to provide innovative solutions that meet your power management needs with the NCP803SN463T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

A stable supply voltage of 3.3V ensures consistent performance of the device.

Power Supplies (V): 1.2/5

Support for multiple power supply options (1.2V and 5V) offers flexibility in various applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows for use in extreme conditions.

Width (mm): 1.3 mm

Compact width of 1.3mm saves space on the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, ensuring efficient power management.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for up to 40 seconds during assembly.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes it suitable for rugged applications.

Technical Specifications

Power Management ICs NCP803SN463T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.63V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.11 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0025 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.63V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.3 mm

Trade Compliance

NCP803SN463T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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