Loading...

NCP382HMN15AATXG

Onsemi

NCP382HMN15AATXG by Onsemi

NCP382HMN15AATXG by Onsemi is a Power Management IC with 5V Nominal Voltage, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40 to 85 °C. Ideal for power supply support circuits requiring a compact design and high reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,200

-

-

-

-

Vyrian

USA . 2,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,274

-

-

-

-

Digiode

USA . 1,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,993

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 372 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$0.340

-

-

-

AZTECH Wire

Italy . 1,103 parts In-Stock

1+ parts

$13.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,103

$13.050

-

-

-

Perfect Parts

USA . 13,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,776

-

-

-

-

Kulean Microsystems

USA . 8,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,013

-

-

-

-

Problanco Electronics

Mexico . 7,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,458

-

-

-

-

TANS Electronics

Latvia . 6,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,785

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Corphita

USA . 1,697 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,697

-

-

-

-

Microchip USA

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

SupplyDigital Components

Austria . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

295

-

-

-

-

UHIMA Technologies

Türkiye . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Overview

Enhance the power management of your devices with the NCP382HMN15AATXG by Onsemi. This high-quality Power Management IC provides reliable and efficient support for your power supply circuits, ensuring optimal performance in industrial applications. With a small outline, heat sink design, and very thin profile, this IC is versatile and easy to integrate. Trust in Onsemi's reputation for excellence and innovation to deliver cutting-edge solutions that meet your needs. Upgrade your devices today with the NCP382HMN15AATXG and experience the difference in power management efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps to reduce weight and cost of the product while still providing good durability and reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, saving time and effort.

Nominal Supply Voltage (Vsup): 5 V

Operating at a common nominal supply voltage of 5V makes this product compatible with a wide range of systems and applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connections and functionality, allowing for multiple inputs and outputs to be managed.

Maximum Operating Temperature: 85 °C

Being able to operate at high temperatures of up to 85 °C ensures reliable performance in harsh or demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating at very low temperatures down to -40 °C, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of Nickel Gold Palladium terminal finish provides good corrosion resistance and ensures stable electrical connections over time.

Width (mm): 3 mm

Compact width of 3mm allows for space-saving designs and integration into tight spaces or small form factor devices.

No. of Channels: 2

Having 2 channels enables this power management IC to handle multiple inputs or outputs simultaneously, increasing its utility and efficiency.

Technical Specifications

Power Management ICs NCP382HMN15AATXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

NCP382HMN15AATXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20