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NCP305LSQ40T1

Onsemi

NCP305LSQ40T1 by Onsemi

NCP305LSQ40T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40 °C to 85°C. Ideal for power supply support circuits in compact designs.

Median Price

$0.216

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,976 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

35,976

-

$0.225

$0.186

$0.166

Verical

USA . 35,976 parts In-Stock

1+ parts

-

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10k+ parts

$0.208

35,976

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$0.208

Distributors (In-Stock)

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Digiode

USA . 1,218 parts In-Stock

1+ parts

$0.175

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1,218

$0.175

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Chip Stock

USA . 8,274 parts In-Stock

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8,274

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Vyrian

USA . 4,027 parts In-Stock

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4,027

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Inventory MP

USA . 767 parts In-Stock

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767

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Bristol Electronics

USA . 767 parts In-Stock

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767

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Mil-Aero Solutions, Inc.

USA . 435 parts In-Stock

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435

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Distributors (Availability)

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Corohmni

South Africa . 416 parts In-Stock

1+ parts

$0.160

100+ parts

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416

$0.160

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Corphita

USA . 635 parts In-Stock

1+ parts

$0.166

100+ parts

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635

$0.166

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Vigor

Singapore . 214 parts In-Stock

1+ parts

$0.180

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214

$0.180

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AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$9.410

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1,157

$9.410

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Continental Prestige Electronics

USA . 35,976 parts In-Stock

1+ parts

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100+ parts

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$0.160

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35,976

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$0.160

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Kulean Microsystems

USA . 5,697 parts In-Stock

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5,697

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SupplyDigital Components

Austria . 3,714 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,455 parts In-Stock

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1,455

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Problanco Electronics

Mexico . 73 parts In-Stock

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UHIMA Technologies

Türkiye . 67 parts In-Stock

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67

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Overview

Elevate your power management game with the NCP305LSQ40T1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and innovation. This Power Management IC is versatile and reliable, making it perfect for various applications. With its small outline and thin profile package style, this IC offers convenience and efficiency like no other. Trust Onsemi to provide you with the best technology for all your power supply support circuit needs. Experience the difference with Onsemi's NCP305LSQ40T1 - where quality meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and heat resistance, making it suitable for a variety of operating conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures stable and reliable power delivery to the device it is supporting.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the power management IC to other components and devices in the circuit.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this power management IC can operate in a wide range of environmental conditions.

Technology: CMOS

The CMOS technology used in this power management IC ensures low power consumption and efficient performance.

Technical Specifications

Power Management ICs NCP305LSQ40T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0036 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ40T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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