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NCP305LSQ22T1

Onsemi

NCP305LSQ22T1 by Onsemi

NCP305LSQ22T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package with dual terminals and operates b/w -40 °C to 85°C. This CMOS technology IC supports power supply circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,509 parts In-Stock

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Digiode

USA . 2,256 parts In-Stock

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AZTECH Wire

Italy . 528 parts In-Stock

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$19.560

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SupplyDigital Components

Austria . 7,447 parts In-Stock

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Kulean Microsystems

USA . 4,619 parts In-Stock

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TANS Electronics

Latvia . 4,501 parts In-Stock

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Problanco Electronics

Mexico . 1,148 parts In-Stock

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UHIMA Technologies

Türkiye . 760 parts In-Stock

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Vigor

Singapore . 612 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

South Africa . 177 parts In-Stock

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Overview

Elevate your power management capabilities with the NCP305LSQ22T1 by Onsemi, a leading manufacturer in power management ICs. Designed with precision and reliability in mind, this small outline, thin profile package offers a nominal supply voltage of 1.5V and a wide range of power supplies from 0.8V to 10V. Perfect for industrial applications, this IC boasts a temperature grade of up to 85 °C and a peak reflow temperature of 235°C. Trust Onsemi to deliver top-notch quality and performance with the NCP305LSQ22T1, providing you with the value and benefits you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the IC, ensuring reliability and easy handling.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 1.5 V

Optimal voltage supply for the IC to operate efficiently and reliably.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for a variety of industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature conditions, ensuring reliable performance in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Power Management ICs NCP305LSQ22T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0033 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.2V

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ22T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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