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NCP303LSN47T1G

Onsemi

NCP303LSN47T1G by Onsemi

NCP303LSN47T1G by Onsemi is a Power Management IC with Vsup of 1.5V, V range of 0.8-10V, and T grade for automotive applications. It has 5 terminals in a small outline package suitable for surface mount assembly. The IC operates b/w -40 to 125 °C with a max seated height of 1.1mm.

Median Price

$18.670

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 2,165 parts In-Stock

1+ parts

$37.100

100+ parts

$18.500

1k+ parts

$14.400

10k+ parts

$11.400

2,165

$37.100

$18.500

$14.400

$11.400

Rochester

USA . 410 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

410

-

$0.241

$0.200

$0.178

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,622 parts In-Stock

1+ parts

$0.130

100+ parts

-

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3,622

$0.130

-

-

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Digiode

USA . 339 parts In-Stock

1+ parts

$0.188

100+ parts

-

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339

$0.188

-

-

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Component Electronics Inc.

Canada . 1,178 parts In-Stock

1+ parts

$2.310

100+ parts

$1.730

1k+ parts

$1.500

10k+ parts

-

1,178

$2.310

$1.730

$1.500

-

Chip Stock

USA . 46,400 parts In-Stock

1+ parts

-

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46,400

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Vyrian

USA . 4,000 parts In-Stock

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4,000

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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3,000

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ComSIT USA

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Sensible Micro Corp

USA . 39 parts In-Stock

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39

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Distributors (Availability)

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Corphita

USA . 1,936 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

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1,936

$0.178

-

-

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$0.198

100+ parts

-

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-

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78

$0.198

-

-

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Vigor

Singapore . 272 parts In-Stock

1+ parts

$0.630

100+ parts

-

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272

$0.630

-

-

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$13.775

100+ parts

$12.535

1k+ parts

$11.296

10k+ parts

-

100

$13.775

$12.535

$11.296

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$18.430

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216

$18.430

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RC Electronics

USA . 82,483 parts In-Stock

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82,483

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Kulean Microsystems

USA . 8,340 parts In-Stock

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8,340

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SupplyDigital Components

Austria . 7,242 parts In-Stock

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7,242

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Problanco Electronics

Mexico . 4,815 parts In-Stock

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4,815

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Kepictronics

USA . 3,700 parts In-Stock

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3,700

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 2,664 parts In-Stock

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2,664

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TANS Electronics

Latvia . 1,736 parts In-Stock

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1,736

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Perfect Parts

USA . 916 parts In-Stock

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916

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UHIMA Technologies

Türkiye . 885 parts In-Stock

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885

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Futuretech Components

Singapore . 691 parts In-Stock

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691

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Microchip USA

USA . 483 parts In-Stock

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483

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Overview

Enhance your power management solutions with the NCP303LSN47T1G by Onsemi. Known for their superior quality and reliability, Onsemi brings you this innovative Power Management IC that offers unmatched performance and efficiency. Ideal for a wide range of applications, this product provides value and benefits to customers looking for precise and reliable power supply support circuitry. Trust Onsemi to deliver cutting-edge technology and exceptional products that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components within the package, making it a reliable choice for power management ICs.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the IC, saving time and potentially reducing cost.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for applications requiring a stable voltage supply at 1.5V, ensuring proper functionality of connected devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand temperature fluctuations commonly found in automotive environments, making it ideal for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliability of the IC.

Technical Specifications

Power Management ICs NCP303LSN47T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.7V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0014 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN47T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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