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NCP303LSN45T1

Onsemi

NCP303LSN45T1 by Onsemi

NCP303LSN45T1 by Onsemi is a Power Management IC with 5 terminals, operating from -40 to 125 °C. It supports supply voltages from 0.8V to 10V and has a threshold voltage of +4.5V. Ideal for automotive applications due to its compact size and low supply current of 0.0012 mA.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 4,505 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

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4,505

$0.770

$0.580

$0.500

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Chip Stock

USA . 46,500 parts In-Stock

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46,500

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Vyrian

USA . 3,826 parts In-Stock

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3,826

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Digiode

USA . 2,356 parts In-Stock

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Sogenti Electronics

Canada . 2,000 parts In-Stock

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2,000

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ACDS - Activité Composants Distribution Service

France . 1,987 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 330 parts In-Stock

1+ parts

$1.150

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330

$1.150

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AZTECH Wire

Italy . 170 parts In-Stock

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$16.060

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170

$16.060

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Kulean Microsystems

USA . 5,917 parts In-Stock

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Perfect Parts

USA . 4,451 parts In-Stock

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Problanco Electronics

Mexico . 3,243 parts In-Stock

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SupplyDigital Components

Austria . 3,193 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,987 parts In-Stock

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1,987

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Glotronic Ltd.

UK . 1,590 parts In-Stock

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TANS Electronics

Latvia . 1,010 parts In-Stock

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Vigor

Singapore . 780 parts In-Stock

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780

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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Corphita

USA . 623 parts In-Stock

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623

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Enhance your power management solutions with the NCP303LSN45T1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Management ICs. This product is designed for a wide range of applications, offering customers unparalleled value and benefits. With a compact package style and a wide temperature range, this IC is perfect for automotive use and other demanding environments. Trust Onsemi to provide you with the superior performance and efficiency you need for your power supply support circuits. Elevate your power management capabilities with the NCP303LSN45T1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape provides easy integration into circuit design and saves space on the PCB.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable operating voltage for powering the device efficiently.

No. of Terminals: 5

Simplified connectivity with a small number of terminals, reducing complexity in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design with thin profile and shrink pitch saves space on the PCB and enhances portability.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures secure electrical connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connecting external components.

Maximum Seated Height: 1.1 mm

Low seated height helps in compact PCB design and reduces overall product size.

Width (mm): 1.5 mm

Narrow width enables efficient utilization of PCB space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit ensures stable and efficient power delivery to the connected devices.

Minimum Supply Voltage (Vsup): 0.8 V

Low minimum supply voltage allows for operation in low power scenarios.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable soldering during manufacturing.

Length: 3 mm

Compact length makes the product suitable for space-constrained applications.

Nominal Threshold Voltage (V): +4.5V

Optimal threshold voltage for reliable operation and stable performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive applications.

Maximum Supply Current (Isup): 0.0012 mA

Low maximum supply current consumption for energy-efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting on the PCB and ease of soldering.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for compact board design and efficient connectivity.

Maximum Supply Voltage (Vsup): 10 V

High maximum supply voltage capability for powering a wide range of devices.

Technical Specifications

Power Management ICs NCP303LSN45T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.5V

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN45T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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