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NCP303LSN34T1G

Onsemi

NCP303LSN34T1G by Onsemi

NCP303LSN34T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V threshold of +3.4V. It is used in automotive applications for power supply support circuits due to its compact size and wide operating temperature range from -40 °C to 125°C.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 8,940 parts In-Stock

1+ parts

$0.178

100+ parts

$0.160

1k+ parts

$0.153

10k+ parts

-

8,940

$0.178

$0.160

$0.153

-

Chip1Stop

Japan . 4,629 parts In-Stock

1+ parts

-

100+ parts

$4.030

1k+ parts

$3.450

10k+ parts

-

4,629

-

$4.030

$3.450

-

Rochester

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

2,985

-

$0.241

$0.200

$0.178

Verical

USA . 2,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.250

2,985

-

-

-

$0.250

Master Electronics

USA . 1,629 parts In-Stock

1+ parts

-

100+ parts

$0.891

1k+ parts

$0.891

10k+ parts

$0.320

1,629

-

$0.891

$0.891

$0.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

1+ parts

$0.188

100+ parts

-

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-

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175

$0.188

-

-

-

Rapid Electronics

USA . 4,629 parts In-Stock

1+ parts

-

100+ parts

$0.380

1k+ parts

-

10k+ parts

-

4,629

-

$0.380

-

-

Vyrian

USA . 3,596 parts In-Stock

1+ parts

-

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3,596

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,856 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

$0.178

-

-

-

Corohmni

South Africa . 490 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

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-

490

$0.198

-

-

-

Vigor

Singapore . 748 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

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748

$0.630

-

-

-

AZTECH Wire

Italy . 749 parts In-Stock

1+ parts

$12.170

100+ parts

-

1k+ parts

-

10k+ parts

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749

$12.170

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$13.358

100+ parts

$12.156

1k+ parts

$10.954

10k+ parts

-

10

$13.358

$12.156

$10.954

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Perfect Parts

USA . 2,468,376 parts In-Stock

1+ parts

-

100+ parts

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2,468,376

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SupplyDigital Components

Austria . 7,306 parts In-Stock

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7,306

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Kulean Microsystems

USA . 5,661 parts In-Stock

1+ parts

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5,661

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Problanco Electronics

Mexico . 5,388 parts In-Stock

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5,388

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Component Stockers USA

USA . 3,778 parts In-Stock

1+ parts

-

100+ parts

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3,778

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-

-

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UHIMA Technologies

Türkiye . 851 parts In-Stock

1+ parts

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851

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-

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Microchip USA

USA . 280 parts In-Stock

1+ parts

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280

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TANS Electronics

Latvia . 190 parts In-Stock

1+ parts

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190

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Overview

Looking for reliable power management solutions? Look no further than the NCP303LSN34T1G by Onsemi. With a reputation for high-quality products, Onsemi delivers top-notch Power Management ICs that are perfect for a variety of applications. From automotive to industrial, this small outline, thin profile IC offers a nominal supply voltage of 1.5V and a maximum operating temperature of 125 °C. Trust Onsemi to provide you with the best in power supply support circuits. Upgrade your systems today with the NCP303LSN34T1G and experience the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures compatibility with a wide range of devices, providing flexibility in usage.

No. of Terminals: 5

Having 5 terminals allows for easy connections and integration into circuit boards, simplifying the overall design.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperatures and harsh environments, making it suitable for industrial applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections, increasing the product's longevity.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it efficient and reliable in power management applications.

Technical Specifications

Power Management ICs NCP303LSN34T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN34T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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