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NCP303LSN25T1

Onsemi

NCP303LSN25T1 by Onsemi

NCP303LSN25T1 by Onsemi is a Power Management IC with Vsup of 1.5V, suitable for automotive applications. It features a small outline package style and operates b/w -40 to 125 °C. With a low Isup of 0.0012mA, it supports power supply circuits efficiently.

Median Price

$0.277

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 980 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

980

-

$0.277

$0.230

$0.205

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,720 parts In-Stock

1+ parts

$0.217

100+ parts

-

1k+ parts

-

10k+ parts

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1,720

$0.217

-

-

-

Chip Stock

USA . 110,380 parts In-Stock

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110,380

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Vyrian

USA . 5,696 parts In-Stock

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5,696

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 287 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

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287

$0.190

-

-

-

Corphita

USA . 849 parts In-Stock

1+ parts

$0.205

100+ parts

-

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849

$0.205

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-

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Corohmni

South Africa . 426 parts In-Stock

1+ parts

$0.228

100+ parts

-

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426

$0.228

-

-

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AZTECH Wire

Italy . 1,050 parts In-Stock

1+ parts

$13.910

100+ parts

-

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10k+ parts

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1,050

$13.910

-

-

-

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

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100+ parts

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30,000

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RC Electronics

USA . 25,000 parts In-Stock

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25,000

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SupplyDigital Components

Austria . 8,241 parts In-Stock

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8,241

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Kulean Microsystems

USA . 7,720 parts In-Stock

1+ parts

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7,720

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TANS Electronics

Latvia . 5,512 parts In-Stock

1+ parts

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5,512

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Problanco Electronics

Mexico . 704 parts In-Stock

1+ parts

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704

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UHIMA Technologies

Türkiye . 511 parts In-Stock

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511

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Microchip USA

USA . 156 parts In-Stock

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156

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Overview

Experience the power of reliable and innovative technology with the NCP303LSN25T1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and performance in their Power Management ICs, making them a trusted choice for a wide range of applications. From automotive to industrial, this product offers unparalleled value with its superior design and functionality. Trust Onsemi to provide you with cutting-edge solutions that will elevate your project to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 1.5 V

The 1.5V nominal supply voltage is within standard operating ranges for many electronic devices, ensuring compatibility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand demanding operational conditions without compromising performance.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, making it suitable for a wide range of applications.

Technical Specifications

Power Management ICs NCP303LSN25T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.5V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.5V

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN25T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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