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NCP301LSN24T1G

Onsemi

NCP301LSN24T1G by Onsemi

NCP301LSN24T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40 °C to 125°C. This CMOS technology IC has a matte tin finish and is surface mountable.

Median Price

$0.232

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

6,000

-

$0.241

$0.200

$0.178

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.223

6,000

-

-

-

$0.223

Flip Electronics (Authorized)

USA . 2,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,569

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,381 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

-

1,381

$0.188

-

-

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Flip Electronics

USA . 2,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,569

-

-

-

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Vyrian

USA . 2,426 parts In-Stock

1+ parts

-

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2,426

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-

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,803 parts In-Stock

1+ parts

$0.168

100+ parts

-

1k+ parts

-

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-

3,803

$0.168

-

-

-

Corphita

USA . 2,259 parts In-Stock

1+ parts

$0.178

100+ parts

-

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10k+ parts

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2,259

$0.178

-

-

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Vigor

Singapore . 980 parts In-Stock

1+ parts

$0.190

100+ parts

-

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980

$0.190

-

-

-

Corohmni

South Africa . 108 parts In-Stock

1+ parts

$0.198

100+ parts

-

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108

$0.198

-

-

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$11.280

100+ parts

-

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707

$11.280

-

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$14.982

100+ parts

$14.832

1k+ parts

$14.233

10k+ parts

-

200

$14.982

$14.832

$14.233

-

Kepictronics

USA . 90,000 parts In-Stock

1+ parts

-

100+ parts

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90,000

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Problanco Electronics

Mexico . 7,521 parts In-Stock

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7,521

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Kulean Microsystems

USA . 6,869 parts In-Stock

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6,869

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SupplyDigital Components

Austria . 6,197 parts In-Stock

1+ parts

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6,197

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TANS Electronics

Latvia . 3,127 parts In-Stock

1+ parts

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3,127

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Futuretech Components

Singapore . 694 parts In-Stock

1+ parts

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694

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UHIMA Technologies

Türkiye . 381 parts In-Stock

1+ parts

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381

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Microchip USA

USA . 171 parts In-Stock

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171

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Overview

Discover the NCP301LSN24T1G by Onsemi, a top-of-the-line Power Management IC that sets the standard for quality and reliability. Manufactured by industry leader Onsemi, this product is designed to provide efficient power supply support in a wide range of applications. With its compact size, high temperature tolerance, and low power consumption, the NCP301LSN24T1G offers unparalleled value and performance to customers looking for a dependable solution for their power management needs. Trust in Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

This feature makes it easy to mount the IC on a circuit board, saving space and improving the overall design.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V is suitable for a wide range of applications, providing flexibility in usage.

No. of Terminals: 5

Having 5 terminals allows for more connections, enhancing the functionality of the IC.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC is suitable for use in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Maximum Supply Voltage (Vsup): 10 V

The maximum supply voltage of 10V allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NCP301LSN24T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301LSN24T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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