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NCP301LSN22T1G

Onsemi

NCP301LSN22T1G by Onsemi

NCP301LSN22T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates b/w -40 °C to 125°C. This CMOS technology IC supports power supply circuits with a max seated height of 1.1mm.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Flip Electronics

USA . 4,940 parts In-Stock

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Bristol Electronics

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Vigor

Singapore . 879 parts In-Stock

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AZTECH Wire

Italy . 336 parts In-Stock

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Component Stockers USA

USA . 640 parts In-Stock

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Metaverse IC Inc.

Canada . 146,880 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Overview

Enhance your power management solutions with the NCP301LSN22T1G by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled performance and reliability. Ideal for automotive applications, this small outline, thin profile IC provides a nominal supply voltage of 1.5V and a wide operating temperature range, ensuring optimal functionality in any environment. Trust Onsemi's innovative technology to deliver value, efficiency, and peace of mind to your projects. Choose the NCP301LSN22T1G for quality that stands out in the crowd.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of high-quality plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, allowing for efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures compatibility with a wide range of devices and applications.

Power Supplies (V): 0.8/10

The wide range of power supply voltages from 0.8V to 10V makes this product versatile and suitable for various power supply requirements.

No. of Terminals: 5

The 5 terminals provide sufficient connections for power management purposes, ensuring stable and efficient operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperatures in demanding environments.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and conductivity, enhancing the overall performance of the product.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient connection options, improving the overall usability of the product.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm enables a slim and compact design, ideal for space-constrained applications.

Width (mm): 1.5 mm

The narrow width of 1.5mm ensures compatibility with standard PCB layouts and allows for efficient use of board space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

The power supply support circuit provides additional functionality and reliability, making this product an excellent choice for power management applications.

Minimum Supply Voltage (Vsup): 0.8 V

The minimum supply voltage of 0.8V ensures compatibility with low-power devices and applications, making this product versatile and efficient.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and effective soldering during assembly, reducing the risk of damage to the product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures reliable soldering and assembly of the product, contributing to its overall performance and longevity.

Length: 3 mm

The compact length of 3mm contributes to the small form factor of the product, making it suitable for space-constrained applications.

Nominal Threshold Voltage (V): +2.2V

The nominal threshold voltage of +2.2V ensures precise and reliable voltage regulation, enhancing the performance and stability of the product.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive environments, making this product suitable for automotive power management applications.

Maximum Supply Current (Isup): 0.0013 mA

The low maximum supply current of 0.0013mA enables efficient power management and helps optimize power consumption in the system.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption, high speed, and reliable performance, making it an excellent choice for power management applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable electrical connections, enhancing the durability and performance of the product.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm allows for high-density mounting and efficient use of board space, making this product suitable for compact designs.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage of 10V allows for compatibility with a wide range of power sources and applications, maximizing the versatility of the product.

Technical Specifications

Power Management ICs NCP301LSN22T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301LSN22T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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