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NCP301LSN20T1G

Onsemi

NCP301LSN20T1G by Onsemi

NCP301LSN20T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V thresholds at +2V. Ideal for automotive applications due to its temperature grade and compact design in a small outline package.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,765 parts In-Stock

1+ parts

$0.210

100+ parts

$0.210

1k+ parts

$0.200

10k+ parts

-

14,765

$0.210

$0.210

$0.200

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Farnell

UK . 259 parts In-Stock

1+ parts

$0.327

100+ parts

$0.165

1k+ parts

$0.128

10k+ parts

$0.109

259

$0.327

$0.165

$0.128

$0.109

EBV Elektronik

Germany . 42,000 parts In-Stock

1+ parts

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42,000

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Flip Electronics (Authorized)

USA . 38,208 parts In-Stock

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38,208

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Avnet

USA . 6,000 parts In-Stock

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$0.167

6,000

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$0.167

Distributors (In-Stock)

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Digiode

USA . 1,418 parts In-Stock

1+ parts

$0.181

100+ parts

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1,418

$0.181

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Flip Electronics

USA . 38,208 parts In-Stock

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38,208

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Chip Stock

USA . 36,470 parts In-Stock

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36,470

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Vyrian

USA . 8,073 parts In-Stock

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8,073

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Connect4Technologies Inc.

Canada . 1,167 parts In-Stock

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1,167

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Rebound Electronics

UK . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 26,815 parts In-Stock

1+ parts

$0.162

100+ parts

-

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26,815

$0.162

-

-

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Semicontronic

India . 26,810 parts In-Stock

1+ parts

$0.162

100+ parts

$0.158

1k+ parts

$0.157

10k+ parts

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26,810

$0.162

$0.158

$0.157

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Corphita

USA . 2,364 parts In-Stock

1+ parts

$0.172

100+ parts

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2,364

$0.172

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Corohmni

South Africa . 109 parts In-Stock

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$0.191

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109

$0.191

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Vigor

Singapore . 355 parts In-Stock

1+ parts

$0.450

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355

$0.450

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AZTECH Wire

Italy . 429 parts In-Stock

1+ parts

$18.940

100+ parts

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429

$18.940

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Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$27.271

100+ parts

$24.817

1k+ parts

$22.362

10k+ parts

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92

$27.271

$24.817

$22.362

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Component Stockers USA

USA . 450 parts In-Stock

1+ parts

$99.990

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450

$99.990

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Kepictronics

USA . 192,000 parts In-Stock

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Perfect Parts

USA . 133,775 parts In-Stock

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 9,698 parts In-Stock

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9,698

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QUARKTWIN TECHNOLOGY LTD

USA . 8,289 parts In-Stock

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Problanco Electronics

Mexico . 7,076 parts In-Stock

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Kulean Microsystems

USA . 5,444 parts In-Stock

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5,444

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A-Z Elektronik GmbH

Germany . 5,393 parts In-Stock

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SupplyDigital Components

Austria . 3,702 parts In-Stock

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Continental Prestige Electronics

USA . 2,095 parts In-Stock

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Argo Parts USA

USA . 2,010 parts In-Stock

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2,010

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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TANS Electronics

Latvia . 701 parts In-Stock

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701

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Futuretech Components

Singapore . 694 parts In-Stock

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694

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Microchip USA

USA . 243 parts In-Stock

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243

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UHIMA Technologies

Türkiye . 119 parts In-Stock

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119

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Overview

Elevate your power management with the NCP301LSN20T1G by Onsemi! Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides customers with the value and benefits they need to optimize their systems. Trust in Onsemi's reputation for excellence and experience the advantages of superior technology with the NCP301LSN20T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to environmental factors, which ensures the reliability and longevity of the product.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures efficient power management while providing stable performance for the device.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for a variety of environments and applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this product energy efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and efficient heat dissipation, ensuring the stability and performance of the product.

Technical Specifications

Power Management ICs NCP301LSN20T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.7/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301LSN20T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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