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NCP300HSN09T1G

Onsemi

NCP300HSN09T1G by Onsemi

NCP300HSN09T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, dual terminal position, and matte tin finish. With a temperature range of -40°C to 85°C, it supports power supply circuits efficiently.

Median Price

$0.241

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 5,870 parts In-Stock

1+ parts

$2.140

100+ parts

$0.596

1k+ parts

$0.401

10k+ parts

-

5,870

$2.140

$0.596

$0.401

-

Rochester

USA . 108,091 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

108,091

-

$0.241

$0.200

$0.178

Flip Electronics (Authorized)

USA . 48,000 parts In-Stock

1+ parts

-

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1k+ parts

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48,000

-

-

-

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Verical

USA . 43,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.223

43,581

-

-

-

$0.223

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 122 parts In-Stock

1+ parts

$0.188

100+ parts

-

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-

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122

$0.188

-

-

-

Flip Electronics

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

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48,000

-

-

-

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Chip Stock

USA . 7,500 parts In-Stock

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-

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7,500

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-

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Vyrian

USA . 7,069 parts In-Stock

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-

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7,069

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-

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

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3,000

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-

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ComSIT USA

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 190 parts In-Stock

1+ parts

$0.178

100+ parts

-

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-

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190

$0.178

-

-

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Corohmni

South Africa . 394 parts In-Stock

1+ parts

$0.198

100+ parts

-

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394

$0.198

-

-

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Vigor

Singapore . 249 parts In-Stock

1+ parts

$0.590

100+ parts

-

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-

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249

$0.590

-

-

-

AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$18.100

100+ parts

-

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853

$18.100

-

-

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Continental Prestige Electronics

USA . 109,491 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.200

10k+ parts

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109,491

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-

$0.200

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Perfect Parts

USA . 44,560 parts In-Stock

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44,560

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Kepictronics

USA . 30,000 parts In-Stock

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30,000

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Microchip USA

USA . 6,628 parts In-Stock

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6,628

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

1+ parts

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6,000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,880 parts In-Stock

1+ parts

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5,880

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Authorized Procurement Solutions

USA . 5,870 parts In-Stock

1+ parts

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5,870

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GreenTree Electronics

Israel . 5,870 parts In-Stock

1+ parts

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5,870

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SupplyDigital Components

Austria . 5,143 parts In-Stock

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5,143

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Kulean Microsystems

USA . 4,510 parts In-Stock

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4,510

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 1,034 parts In-Stock

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1,034

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Problanco Electronics

Mexico . 798 parts In-Stock

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798

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Futuretech Components

Singapore . 694 parts In-Stock

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694

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Lixinc

USA . 591 parts In-Stock

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591

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UHIMA Technologies

Türkiye . 582 parts In-Stock

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582

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Overview

Power up your devices with the NCP300HSN09T1G by Onsemi, a top-of-the-line Power Management IC that guarantees reliability and efficiency. Manufactured by Onsemi, a trusted name in the industry, this versatile component is perfect for a wide range of applications. From smartphones to laptops, this IC ensures optimal performance and power control. Say goodbye to downtime and hello to seamless operation with the NCP300HSN09T1G. Experience the quality, value, and benefits that only Onsemi can offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the Power Management IC.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 0.85 V

Provides a stable and reliable power input for the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy efficient and reliable.

Maximum Operating Temperature: 85 °C

Ensures the IC can operate efficiently even in high temperature environments.

Technical Specifications

Power Management ICs NCP300HSN09T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 0.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP300HSN09T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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