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NCP2890DMR2

Onsemi

NCP2890DMR2 by Onsemi

NCP2890DMR2 by Onsemi is an audio amplifier IC with 1.08W output power, operating at -40 to 85 °C. It has a supply voltage range of 2.2-5.5V and consumes up to 5.5mA current, suitable for industrial applications requiring small form factor amplification in audio and video systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 36,600 parts In-Stock

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36,600

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Vyrian

USA . 4,966 parts In-Stock

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4,966

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Cyclops Electronics Ltd

UK . 2,780 parts In-Stock

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2,780

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Digiode

USA . 2,222 parts In-Stock

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2,222

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Distributors (Availability)

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Vigor

Singapore . 370 parts In-Stock

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$0.310

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370

$0.310

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Component Stockers USA

USA . 2,090 parts In-Stock

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$1.840

100+ parts

$1.750

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$1.690

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2,090

$1.840

$1.750

$1.690

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AZTECH Wire

Italy . 294 parts In-Stock

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$20.400

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294

$20.400

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QUARKTWIN TECHNOLOGY LTD

USA . 15,379 parts In-Stock

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15,379

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Assy Fe

Spain . 7,020 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,786 parts In-Stock

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6,786

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SupplyDigital Components

Austria . 6,068 parts In-Stock

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Problanco Electronics

Mexico . 5,331 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,441 parts In-Stock

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Kulean Microsystems

USA . 3,014 parts In-Stock

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Metaverse IC Inc.

Canada . 2,780 parts In-Stock

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2,780

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TANS Electronics

Latvia . 1,763 parts In-Stock

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1,763

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Corphita

USA . 790 parts In-Stock

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790

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Futuretech Components

Singapore . 695 parts In-Stock

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695

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Perfect Parts

USA . 627 parts In-Stock

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627

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UHIMA Technologies

Türkiye . 610 parts In-Stock

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610

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Corohmni

South Africa . 67 parts In-Stock

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Overview

Looking to elevate your audio experience? Look no further than the NCP2890DMR2 by Onsemi. With a reputation for high-quality products, Onsemi delivers excellence in the Audio & Video Amplifiers category. This versatile amplifier offers a nominal output power of 1.08 W and a wide temperature range, making it perfect for industrial applications. With a compact design and low power consumption, this amplifier is both efficient and effective. Upgrade your sound system today with the NCP2890DMR2 and enjoy unparalleled audio quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the amplifier easy to handle and resistant to damage.

Surface Mount: YES

Being surface-mounted allows for easier and neater installation, saving space and making the amplifier ideal for compact setups.

Power Supplies (V): 2.5/5

Having multiple power supply options (2.5V and 5V) provides flexibility in different operating environments and power sources.

Nominal Output Power: 1.08 W

With a nominal output power of 1.08W, this amplifier is capable of delivering clear and powerful audio signals, making it suitable for various audio applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures stable performance even in harsh environmental conditions, making the amplifier reliable for long-term use.

Technical Specifications

Audio & Video Amplifiers NCP2890DMR2 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.08 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCP2890DMR2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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