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NB4N7132DTG

Onsemi

NB4N7132DTG by Onsemi

NB4N7132DTG by Onsemi is a network interface IC with 28 terminals, operating at 3.3V. It features a small outline package style and Gull Wing terminal form, suitable for industrial temperature grade applications. With a max supply current of 0.125mA, it supports circuit in telecom systems efficiently.

Median Price

$4.287

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,373 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

3,373

-

$3.430

$3.070

$2.890

DigiKey

USA . 3,373 parts In-Stock

1+ parts

-

100+ parts

$4.510

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-

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-

3,373

-

$4.510

-

-

Verical

USA . 2,659 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

2,659

-

$4.287

$3.837

$3.612

Flip Electronics (Authorized)

USA . 150 parts In-Stock

1+ parts

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150

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Distributors (In-Stock)

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Digiode

USA . 1,399 parts In-Stock

1+ parts

$3.629

100+ parts

-

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1,399

$3.629

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Chip Stock

USA . 25,000 parts In-Stock

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25,000

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Vyrian

USA . 12,849 parts In-Stock

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12,849

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Flip Electronics

USA . 150 parts In-Stock

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150

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 70 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

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70

$3.160

-

-

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Corphita

USA . 50 parts In-Stock

1+ parts

$3.438

100+ parts

-

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50

$3.438

-

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AZTECH Wire

Italy . 975 parts In-Stock

1+ parts

$19.390

100+ parts

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975

$19.390

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TANS Electronics

Latvia . 6,856 parts In-Stock

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Kulean Microsystems

USA . 5,883 parts In-Stock

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Problanco Electronics

Mexico . 4,380 parts In-Stock

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4,380

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Continental Prestige Electronics

USA . 3,373 parts In-Stock

1+ parts

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$3.160

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3,373

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$3.160

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SupplyDigital Components

Austria . 2,175 parts In-Stock

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2,175

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Microchip USA

USA . 470 parts In-Stock

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470

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Perfect Parts

USA . 224 parts In-Stock

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224

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UHIMA Technologies

Türkiye . 17 parts In-Stock

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17

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Overview

Unlock the power of seamless network connectivity with the NB4N7132DTG by Onsemi. Crafted with precision and expertise, this innovative product boasts top-notch quality and reliability. Designed for a wide range of applications in the network interfaces category, this gem from Onsemi offers unmatched value and benefits to customers. Experience superior performance and efficiency like never before with the NB4N7132DTG - a game-changer in the world of network interfaces.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable construction makes the product easy to handle and long-lasting.

Surface Mount: YES

Ease of installation and space-saving design.

Package Shape: RECTANGULAR

Compact shape for efficient PCB layout.

Power Supplies (V): 3.3

Standard power supply voltage for compatibility with various systems.

No. of Terminals: 28

Sufficient number of terminals for connectivity options.

Maximum Operating Temperature: 85 °C

High operating temperature range for reliable performance in various environments.

Width: 4.4 mm

Narrow width for compact design and space efficiency.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature requirements.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage supply for easy integration.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for versatile use in different environments.

Technical Specifications

Network Interfaces NB4N7132DTG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.125 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NB4N7132DTG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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