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NB4N1158DTG

Onsemi

NB4N1158DTG by Onsemi

NB4N1158DTG by Onsemi is a network interface IC with 28 terminals, operating at temperatures from -40 to 85 °C. It has a supply voltage of 3.3V and low current consumption of 0.075mA, suitable for industrial telecom circuits due to its small outline package style and dual terminal position.

Median Price

$3.130

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,373 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

1,373

-

$3.130

$2.800

$2.630

DigiKey

USA . 1,373 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.610

10k+ parts

$3.610

1,373

-

$3.610

$3.610

$3.610

Farnell

UK . 1,373 parts In-Stock

1+ parts

-

100+ parts

$2.960

1k+ parts

-

10k+ parts

-

1,373

-

$2.960

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 433 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$2.960

-

-

-

Digiode

USA . 1,531 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$3.296

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 209 parts In-Stock

1+ parts

$2.960

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$2.960

-

-

-

Corphita

USA . 487 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

487

$3.123

-

-

-

Kulean Microsystems

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

SupplyDigital Components

Austria . 2,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,309

-

-

-

-

Continental Prestige Electronics

USA . 1,373 parts In-Stock

1+ parts

-

100+ parts

$2.870

1k+ parts

-

10k+ parts

-

1,373

-

$2.870

-

-

TANS Electronics

Latvia . 1,170 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,170

-

-

-

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Microchip USA

USA . 483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

483

-

-

-

-

Problanco Electronics

Mexico . 352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

352

-

-

-

-

UHIMA Technologies

Türkiye . 219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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219

-

-

-

-

Overview

Elevate your network interfaces with the NB4N1158DTG by Onsemi, a top-quality product designed to exceed industry standards. Manufactured by Onsemi, a trusted leader in the field, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, this small outline, thin profile package provides customers with seamless connectivity and enhanced functionality. Experience the value and benefits of this innovative product, ensuring optimal performance and efficiency for all your networking needs. Elevate your connections with Onsemi's NB4N1158DTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for use in various networking environments.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts, making integration into existing systems seamless.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with a wide range of devices and power sources.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling the product to support various network configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim design with shrink pitch enables space-saving solutions in network interface applications.

Maximum Operating Temperature: 85 °C

Ability to operate at high temperatures of up to 85 °C ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With the capability to function at low temperatures down to -40 °C, the product remains operational in harsh cold climates.

Terminal Finish: TIN

Tin terminal finish provides excellent conductivity and corrosion resistance for long-term reliability in networking applications.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, enhancing the product's versatility.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm allows for a compact and neat profile in network interface designs.

Width: 4.4 mm

Narrow width of 4.4mm enables efficient use of space on PCB layouts, especially in densely populated networking systems.

Peak Reflow Temperature °C: 260

Withstand peak reflow temperatures of 260 °C during the soldering process, ensuring secure and stable connections on the circuit board.

Length: 9.7 mm

Length of 9.7mm provides a balanced footprint for the product, allowing for easy integration into various network interface setups.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures the product's reliability and performance in harsh operating conditions.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering points and ease of assembly, enhancing the product's overall durability.

Maximum Supply Current: 0.075 mA

Low maximum supply current of 0.075mA minimizes power consumption, making the product energy-efficient in network operations.

Telecom IC Type: SUPPORT CIRCUIT

Support circuit for telecom IC types ensures compatibility and seamless integration with various communication protocols and networking devices.

Nominal Supply Voltage: 3.3 V

Consistent supply voltage of 3.3V provides stable power input for the product, ensuring reliable performance in networking applications.

Terminal Pitch: 0.65 mm

Terminal pitch of 0.65mm allows for precise and secure connections, enhancing signal integrity and data transmission in network interfaces.

Technical Specifications

Network Interfaces NB4N1158DTG attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NB4N1158DTG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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