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NB4N7132DTR2G

Onsemi

NB4N7132DTR2G by Onsemi

NB4N7132DTR2G by Onsemi is a network interface IC with 28 terminals, operating at 3.3V. It has a small outline package style and supports circuits in industrial temperature grades. With a terminal pitch of 0.65mm, it is ideal for telecom applications requiring low supply current (0.125mA).

Median Price

$4.398

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,445 parts In-Stock

1+ parts

$11.400

100+ parts

$5.990

1k+ parts

$4.450

10k+ parts

-

2,445

$11.400

$5.990

$4.450

-

Rochester

USA . 33,866 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

33,866

-

$3.430

$3.070

$2.890

DigiKey

USA . 33,866 parts In-Stock

1+ parts

-

100+ parts

$4.510

1k+ parts

-

10k+ parts

-

33,866

-

$4.510

-

-

Verical

USA . 15,721 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

15,721

-

$4.287

$3.837

$3.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 320 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$3.160

-

-

-

Digiode

USA . 1,805 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

-

10k+ parts

-

1,805

$3.629

-

-

-

Chip Stock

USA . 79,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

79,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 408 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$3.160

-

-

-

Corphita

USA . 1,421 parts In-Stock

1+ parts

$3.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$3.438

-

-

-

Component Stockers USA

USA . 39,978 parts In-Stock

1+ parts

$3.870

100+ parts

$3.630

1k+ parts

$3.280

10k+ parts

$3.280

39,978

$3.870

$3.630

$3.280

$3.280

Continental Prestige Electronics

USA . 33,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.160

10k+ parts

-

33,866

-

-

$3.160

-

Perfect Parts

USA . 17,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,058

-

-

-

-

Problanco Electronics

Mexico . 7,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,989

-

-

-

-

SupplyDigital Components

Austria . 7,007 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,007

-

-

-

-

Kulean Microsystems

USA . 6,677 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,677

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,494

-

-

-

-

Assy Fe

Spain . 6,300 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,300

-

-

-

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Kepictronics

USA . 3,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,347

-

-

-

-

TANS Electronics

Latvia . 3,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,062

-

-

-

-

Futuretech Components

Singapore . 708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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708

-

-

-

-

UHIMA Technologies

Türkiye . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Microchip USA

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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392

-

-

-

-

Overview

Enhance your network interfaces with the NB4N7132DTR2G by Onsemi. Crafted with precision and expertise, Onsemi delivers top-notch quality and reliability to meet your networking needs. Ideal for a wide range of applications, this product offers seamless connectivity and efficiency. Elevate your electronic designs with the value and benefits that this innovative product brings. Trust Onsemi to provide you with the advantage you need in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and resistance to damage, making this product long-lasting.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards.

Power Supplies (V): 3.3

Operates at a standard voltage, ensuring compatibility with various systems.

No. of Terminals: 28

Provides multiple connection points for enhanced functionality.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial use.

Width: 4.4 mm

Compact size allows for space-efficient integration into devices.

Nominal Supply Voltage: 3.3 V

Matches the standard supply voltage, ensuring compatibility with various systems.

Technical Specifications

Network Interfaces NB4N7132DTR2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.125 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NB4N7132DTR2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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