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NB4N1158DTR2G

Onsemi

NB4N1158DTR2G by Onsemi

NB4N1158DTR2G by Onsemi is a network interface IC with 28 terminals, operating at 3.3V. It features a small outline package style and supports circuits in industrial temperature grades. This telecom IC has a max supply current of 0.075mA and is suitable for various communication applications.

Median Price

$3.766

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

$15.500

100+ parts

$10.100

1k+ parts

$8.130

10k+ parts

-

2,400

$15.500

$10.100

$8.130

-

Rochester

USA . 17,480 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

17,480

-

$3.130

$2.800

$2.630

DigiKey

USA . 17,480 parts In-Stock

1+ parts

-

100+ parts

$3.620

1k+ parts

$3.620

10k+ parts

$3.620

17,480

-

$3.620

$3.620

$3.620

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

-

9,990

-

$3.913

$3.500

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,445 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

1,445

$3.306

-

-

-

Vyrian

USA . 824 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$3.480

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,500 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

$3.132

-

-

-

Corohmni

South Africa . 326 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

326

$3.480

-

-

-

Component Stockers USA

USA . 23,606 parts In-Stock

1+ parts

$3.510

100+ parts

$3.300

1k+ parts

$2.980

10k+ parts

$2.980

23,606

$3.510

$3.300

$2.980

$2.980

QUARKTWIN TECHNOLOGY LTD

USA . 27,594 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,594

-

-

-

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Continental Prestige Electronics

USA . 17,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.870

10k+ parts

-

17,480

-

-

$2.870

-

Perfect Parts

USA . 16,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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16,296

-

-

-

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TANS Electronics

Latvia . 4,147 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,147

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-

-

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Kulean Microsystems

USA . 3,038 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,038

-

-

-

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Authorized Procurement Solutions

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,400

-

-

-

-

GreenTree Electronics

Israel . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,400

-

-

-

-

SupplyDigital Components

Austria . 2,331 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,331

-

-

-

-

UHIMA Technologies

Türkiye . 943 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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943

-

-

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Futuretech Components

Singapore . 708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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708

-

-

-

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Problanco Electronics

Mexico . 417 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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417

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Microchip USA

USA . 300 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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300

-

-

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Kepictronics

USA . 225 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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225

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Overview

Discover the cutting-edge NB4N1158DTR2G by Onsemi, a top-tier manufacturer of network interfaces. This innovative product offers unparalleled performance, reliability, and versatility for a wide range of applications. With a focus on quality and precision, Onsemi delivers a superior solution that exceeds industry standards. Experience seamless connectivity and enhanced functionality with the NB4N1158DTR2G, providing customers with unmatched value and benefits. Elevate your projects with this exceptional product and unleash its full potential in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mount compatible makes installation easier and more efficient, saving time and effort during assembly.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of devices and systems, making it versatile and easy to integrate.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product is suitable for use in industrial environments where temperatures can vary.

Minimum Operating Temperature: -40 °C

The product can withstand low temperatures of -40 °C, making it suitable for use in a variety of environments.

Terminal Finish: TIN

The use of tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm allows for compact and slim designs, ideal for space-constrained applications.

Technical Specifications

Network Interfaces NB4N1158DTR2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NB4N1158DTR2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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