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IFX1051LEXUMA1

Infineon Technologies

IFX1051LEXUMA1 by Infineon Technologies

IFX1051LEXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating temperature range of -40 to 125°C. It features a small outline package style and is suitable for automotive applications requiring a 5V supply voltage. The IC type is an interface circuit designed for surface mount assembly with tin terminal finish.

Median Price

$0.632

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,900 parts In-Stock

1+ parts

$0.632

100+ parts

$0.594

1k+ parts

$0.537

10k+ parts

-

15,900

$0.632

$0.594

$0.537

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 581 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$0.600

-

-

-

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$1.278

-

-

-

Vyrian

USA . 7,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,903

-

-

-

-

Chip Stock

USA . 3,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,330

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,727 parts In-Stock

1+ parts

$0.540

100+ parts

-

1k+ parts

-

10k+ parts

-

15,727

$0.540

-

-

-

Semicontronic

India . 15,467 parts In-Stock

1+ parts

$0.540

100+ parts

$0.526

1k+ parts

$0.524

10k+ parts

-

15,467

$0.540

$0.526

$0.524

-

Corphita

USA . 704 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$0.569

-

-

-

Continental Prestige Electronics

USA . 4,103 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

$1.252

4,103

$1.278

-

-

$1.252

Argo Parts USA

USA . 643 parts In-Stock

1+ parts

$1.278

100+ parts

-

1k+ parts

-

10k+ parts

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643

$1.278

-

-

-

AZTECH Wire

Italy . 158 parts In-Stock

1+ parts

$8.180

100+ parts

-

1k+ parts

-

10k+ parts

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158

$8.180

-

-

-

Aztec Data Supply Inc.

USA . 2,299 parts In-Stock

1+ parts

$9.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,299

$9.550

-

-

-

Modulus Dynamics

Lithuania . 2,606 parts In-Stock

1+ parts

$11.401

100+ parts

$10.945

1k+ parts

$10.489

10k+ parts

-

2,606

$11.401

$10.945

$10.489

-

Corohmni

South Africa . 51 parts In-Stock

1+ parts

$13.205

100+ parts

-

1k+ parts

-

10k+ parts

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51

$13.205

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.728

100+ parts

$15.892

1k+ parts

$15.892

10k+ parts

-

500

$16.728

$15.892

$15.892

-

Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

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11,200

-

-

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RC Electronics

USA . 9,500 parts In-Stock

1+ parts

-

100+ parts

$1.010

1k+ parts

$0.930

10k+ parts

$0.900

9,500

-

$1.010

$0.930

$0.900

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

-

-

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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900

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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-

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Microchip USA

USA . 421 parts In-Stock

1+ parts

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421

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Overview

Elevate your network interfaces with the IFX1051LEXUMA1 from Infineon Technologies. Crafted with precision and expertise, this small outline, heat sink component offers unparalleled performance and reliability. Ideal for automotive applications, this interface circuit boasts a dual terminal position and a nominal supply voltage of 5V, ensuring seamless connectivity. Experience the difference with Infineon's top-tier quality and cutting-edge technology. Unlock endless possibilities with the IFX1051LEXUMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for long-term use in networking applications.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into various network devices, saving time and effort during assembly.

No. of Functions: 1

With one function, this product is designed for a specific networking task, ensuring efficiency and optimal performance in its intended use.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and allowing for easier placement within network systems.

No. of Terminals: 8

The eight terminals offer ample connectivity options, allowing for versatile connections in networking setups.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

The combination of small outline, heat sink/slug, and thin profile design makes this product suitable for compact networking devices where space is limited.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is capable of withstanding heat and operating reliably in demanding networking environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this product can function effectively in a wide range of environmental conditions, making it versatile for different applications.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring stable and reliable connections in networking systems.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connection orientations, accommodating various network setups and configurations.

Maximum Seated Height: 1.15 mm

With a low maximum seated height, this product is suitable for slim networking devices, contributing to a sleek and compact design.

Width: 3 mm

The 3mm width of this product offers compatibility with standard networking equipment and facilitates easy integration into existing setups.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure soldering during assembly, preventing disconnection issues and enhancing product reliability.

Length: 3 mm

The 3mm length of this product contributes to its compact size, making it suitable for space-constrained networking applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product is built to withstand harsh conditions and deliver consistent performance in challenging environments.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with regulations, making this product a sustainable choice for networking solutions.

Telecom IC Type: INTERFACE CIRCUIT

With an interface circuit telecom IC type, this product is specialized for communication tasks, ensuring seamless data transmission in network systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power to this product, ensuring reliable operation and consistent performance in networking applications.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for precise connections and compatibility with standard PCB layouts, facilitating easy installation and integration.

Moisture Sensitivity Level (MSL): 2A

The moisture sensitivity level of 2A indicates that this product has a moderate tolerance to moisture exposure, making it suitable for indoor networking environments.

Technical Specifications

Network Interfaces IFX1051LEXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.15 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

IFX1051LEXUMA1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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