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IFX1051SJXUMA1

Infineon Technologies

IFX1051SJXUMA1 by Infineon Technologies

IFX1051SJXUMA1 by Infineon Technologies is a Network Interface with 8 terminals, operating b/w -40 to 125°C. It has Gull Wing terminals, suitable for automotive applications with a supply voltage of 5V. The package is small outline, rectangular in shape, and surface mountable.

Median Price

$0.743

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.743

100+ parts

-

1k+ parts

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10

$0.743

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Vyrian

USA . 4,517 parts In-Stock

1+ parts

-

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4,517

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Digiode

USA . 944 parts In-Stock

1+ parts

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944

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

$0.699

10k+ parts

-

1,000

$0.728

-

$0.699

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Continental Prestige Electronics

USA . 3,241 parts In-Stock

1+ parts

$0.743

100+ parts

-

1k+ parts

-

10k+ parts

$0.728

3,241

$0.743

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-

$0.728

Argo Parts USA

USA . 1,873 parts In-Stock

1+ parts

$0.743

100+ parts

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1k+ parts

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1,873

$0.743

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Modulus Dynamics

Lithuania . 2,653 parts In-Stock

1+ parts

$0.743

100+ parts

$0.713

1k+ parts

$0.684

10k+ parts

-

2,653

$0.743

$0.713

$0.684

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Corohmni

South Africa . 1 parts In-Stock

1+ parts

$0.743

100+ parts

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1

$0.743

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.765

100+ parts

$0.727

1k+ parts

$0.727

10k+ parts

-

1,000

$0.765

$0.727

$0.727

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AZTECH Wire

Italy . 432 parts In-Stock

1+ parts

$12.553

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432

$12.553

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Aztec Data Supply Inc.

USA . 30,571 parts In-Stock

1+ parts

$13.250

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30,571

$13.250

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Semicontronic

India . 938 parts In-Stock

1+ parts

$465.000

100+ parts

$453.375

1k+ parts

$451.050

10k+ parts

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938

$465.000

$453.375

$451.050

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Ampacity Inc.

Singapore . 1,356 parts In-Stock

1+ parts

$536.000

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1,356

$536.000

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Microchip USA

USA . 4,105 parts In-Stock

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4,105

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QUARKTWIN TECHNOLOGY LTD

USA . 2,658 parts In-Stock

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2,658

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Corphita

USA . 174 parts In-Stock

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174

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Overview

Unlock seamless connectivity with the IFX1051SJXUMA1 by Infineon Technologies. Crafted with precision and expertise, this network interface module offers unparalleled reliability and performance. Ideal for automotive applications, this small outline package delivers a nominal supply voltage of 5V, ensuring optimal functionality in any environment. Experience the value of superior quality and cutting-edge technology with the IFX1051SJXUMA1, setting new standards in network interfaces.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to damage, making this product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, ideal for space-saving in electronic devices.

No. of Terminals: 8

With 8 terminals, this network interface offers versatile connectivity options for various devices and systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style ensures efficient use of space on PCBs, suitable for compact electronic designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows this product to function reliably in harsh environments without overheating.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures this network interface can operate effectively in cold conditions, making it versatile for diverse environments.

Terminal Finish: NICKEL GOLD PALLADIUM

Nickel, gold, and palladium terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and connectivity options, enhancing versatility.

Maximum Seated Height: 1.75 mm

Low maximum seated height enables slim and compact device designs, contributing to overall space efficiency.

Width: 4 mm

Compact width dimension makes this network interface suitable for small electronic devices with limited space availability.

Peak Reflow Temperature °C: 260

High peak reflow temperature indicates excellent soldering capabilities, ensuring secure and reliable connections on PCBs.

Length: 5 mm

Short length dimension contributes to the overall compactness of electronic devices using this network interface.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures this product can withstand automotive applications' demanding temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and installation on circuit boards, enhancing the product's usability.

Telecom IC Type: INTERFACE CIRCUIT

Designed for interface circuit applications in the telecom industry, ensuring reliable data transmission and communication.

Nominal Supply Voltage: 5 V

Stable 5V supply voltage requirement makes this network interface compatible with a wide range of electronic systems and devices.

Terminal Pitch: 1.27 mm

With a standard terminal pitch of 1.27mm, this product allows for easy integration into various circuit board designs.

Moisture Sensitivity Level (MSL): 2A

Moisture sensitivity level of 2A indicates this product has moderate resistance to moisture, suitable for use in various environmental conditions.

Technical Specifications

Network Interfaces IFX1051SJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

IFX1051SJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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